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A kind of aluminum-silicon alloy graphite composite heat-conducting material and its preparation and application

A technology of composite thermal conductive material and aluminum-silicon alloy, which is applied in the field of thermal management materials, can solve the problems of unsmooth development of aluminum-based graphite composite materials, difficulty in composite forming of aluminum matrix and graphite sheet, damage to thermal conductivity and strength of composite materials, etc. It is beneficial to the promotion of large-scale industrialization, shortening the preparation time, and improving the fluidity.

Active Publication Date: 2021-09-28
HONG KONG PRODUCTIVITY COUNCIL
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

The common process of the existing process preparation technology is powder metallurgy preparation, but in the preparation process, there are mainly the following three difficulties: (1) the aluminum-based graphite composite material is prepared by pressing first and then sintering, because the surface of the aluminum metal powder It is easy to oxidize, resulting in low sintering density and damage to the strength of the composite material; (2) the melting point of pure aluminum is high (660°C), and the preparation of aluminum-based composite materials needs to be sintered at a high temperature above 500°C for a long time to form a dense structure, which is easy Lead to the formation of harmful interfacial reaction phase Al at the interface of aluminum and graphite 4 C 3 , leading to a sharp decrease in the strength of the composite material, and it is easy to break; (3) Due to the large difference in thermal expansion coefficient between aluminum and graphite, it is easy to produce local deformation at the interface during the sintering process, resulting in cracking of the aluminum and graphite interface, which damages the thermal conductivity of the composite material rate and intensity
There are also researchers trying to use the impregnation method, which includes pressure infiltration and air pressure infiltration to prepare aluminum-graphite sheet composites. Researchers have found that graphite sheets overlap each other under pressure, and it is difficult for Al atoms to diffuse or impregnate graphite sheets. Between them, there is great difficulty in the composite forming of the aluminum matrix and the graphite sheet, which in turn affects the thermal conductivity of the material
Some researchers also used spark plasma sintering to prepare aluminum-graphite sheet composites, but found that the graphite sheets in the composite structure were easily bent under pressure.
[0008] Although aluminum-graphite composites have great potential, the thermal conductivity of aluminum-graphite composites reported in existing studies is not very satisfactory, and the development of aluminum-based graphite composites is not smooth, mainly because of the impact on aluminum-graphite composites. There are many factors affecting the thermal conductivity of graphite composites, such as the type, shape, size, volume fraction, orientation, and interface structure of graphite fillers.

Method used

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  • A kind of aluminum-silicon alloy graphite composite heat-conducting material and its preparation and application
  • A kind of aluminum-silicon alloy graphite composite heat-conducting material and its preparation and application
  • A kind of aluminum-silicon alloy graphite composite heat-conducting material and its preparation and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] This embodiment provides an aluminum-silicon alloy graphite composite heat-conducting material, which is made of dried aluminum-silicon alloy powder base material (aluminum-silicon alloy powder produced by Hunan Ningxiang Jiweixin Metal Powder Material Co., Ltd., with a particle size of 2 -8μm, nearly spherical shape) and dried graphite flake reinforcement (Graphite Flakes, abbreviated as GF, which is the high-purity flake graphite No. XF050 produced by Jiangsu Nanjing Xianfeng Nano Material Technology Co., Ltd., the mesh number is 80 mesh, purity is 99.9wt%) after mixing uniformly in the glass;

[0050] The obtained mixture is compacted in a graphite mold, and then prepared by hot pressing and sintering under vacuum conditions. The aluminum-silicon alloy graphite composite heat-conducting material prepared in this example is recorded as material 1#, and in material 1# , flake graphite is evenly distributed in the base material aluminum-silicon alloy powder Al-20% Si, a...

Embodiment 2

[0056] This embodiment provides an aluminum-silicon alloy graphite composite heat-conducting material, which is after mixing aluminum-silicon alloy powder Al-20% Si (same as Example 1) with flake graphite sheet (same as Example 1), and then mixing the obtained mixture Compacted in a graphite mold, and then prepared after hot pressing and sintering under vacuum conditions, wherein, the vacuum hot press used in the hot pressing and sintering process of this embodiment and the graphite mold are the same as in Example 1;

[0057] The aluminum-silicon alloy graphite composite heat-conducting material prepared in this example is recorded as material 2#. In material 2#, flake graphite is evenly distributed in the base material aluminum-silicon alloy powder Al-20% Si, and no bridging phenomenon occurs;

[0058] Wherein, based on the total weight of the mixture as 100%, the content of the graphite flakes is 15 wt%, and the content of the aluminum-silicon alloy powder Al-20% Si is 85 wt%...

Embodiment 3

[0061] This embodiment provides an aluminum-silicon alloy graphite composite heat-conducting material, which is after mixing aluminum-silicon alloy powder Al-20% Si (same as Example 1) with flake graphite sheet (same as Example 1), and then mixing the obtained mixture Compacted in a graphite mold, and then prepared after hot pressing and sintering under vacuum conditions, wherein, the vacuum hot press used in the hot pressing and sintering process of this embodiment and the graphite mold are the same as in Example 1;

[0062] The aluminum-silicon alloy graphite composite heat-conducting material prepared in this example is recorded as material 3#. In material 3#, flake graphite is evenly distributed in the base material aluminum-silicon alloy powder Al-20% Si, and no bridging phenomenon occurs;

[0063] Wherein, based on the total weight of the mixture as 100%, the content of the graphite flakes is 15 wt%, and the content of the aluminum-silicon alloy powder Al-20% Si is 85 wt%...

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Abstract

The invention provides an aluminum-silicon alloy graphite composite heat-conducting material and its preparation and application. The aluminum-silicon alloy-graphite composite heat-conducting material is obtained by mixing aluminum-silicon alloy powder and graphite filler, and then subjecting the obtained mixture to It is prepared after hot pressing and sintering; in the said material, the graphite filler is uniformly dispersed in the aluminum-silicon alloy matrix. The material provided by the present invention has higher thermal conductivity, higher compactness, higher effective strength and lower coefficient of thermal expansion, and can be used to make high-power electronic devices to solve the problem of high-power electronic devices. heat conduction problem.

Description

technical field [0001] The invention relates to an aluminum-silicon alloy graphite composite heat-conducting material and its preparation and application, belonging to the technical field of heat management materials. Background technique [0002] With the continuous development of electronic devices in the direction of miniaturization, light weight and high performance, their power density continues to increase and the heat generation per unit volume is increasing. An increase in temperature will increase the thermal stress between the packaging material and the chip, and overheating will seriously affect the performance, reliability and service life of electronic products. Therefore, the heat conduction problem of high-power electronic devices has become an urgent problem to be solved. [0003] Traditional heat conduction methods such as convective heat transfer and forced air cooling have been difficult to meet the heat conduction requirements of high-power electronic de...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/05B22F3/14C22C21/00C22C21/02
CPCB22F3/14C22C1/05C22C21/00C22C21/02
Inventor 黎伟华杨浩坤胡勇
Owner HONG KONG PRODUCTIVITY COUNCIL
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