Electrocondution slurry for chip component termination electrode

A technology of conductive paste and terminal electrodes, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of reducing the metal content of conductive paste, the adhesion strength of terminal electrodes, and the reduction of sintering compactness.

Inactive Publication Date: 2012-12-26
廖晓峰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] However, reducing the metal content of the electroconductive paste has a negative effect, that is, the sintering density will decrease
When the sintering density drops to a certain level, in the subsequent electroplating process, the electroplating solution will penetrate into the interior of the terminal electrode, causing a significant decrease in the adhesion strength of the terminal electrode.

Method used

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  • Electrocondution slurry for chip component termination electrode
  • Electrocondution slurry for chip component termination electrode
  • Electrocondution slurry for chip component termination electrode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 11

[0043] Example 11 does not add silver micropowder, and the adhesion strength of the terminal electrode is as good as that of Example 13 which adds 10% silver micropowder. It shows that when the silver content is high, silver paste with excellent performance can also be produced without adding silver powder.

[0044] But, when silver content is 55% and 65%, do not add embodiment 1 and embodiment 6 of silver micropowder, the adhesion strength of terminal electrode is very low, when adding the amount of silver micropowder less than 5% of silver powder total amount, The adhesion strength of the terminal electrodes was also low, as in Example 2 and Example 7. In Example 3 and Example 8 with 10% silver powder added, the adhesion strength of the terminal electrode is very good, which is equivalent to the silver paste with 75% silver content. When the amount of silver powder added is greater than 50% of the total amount of silver powder, the adhesion strength of the terminal electrod...

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Abstract

The invention provides electrocondution slurry used for a chip component termination electrode. The electrocondution slurry comprise the following components in percentage by weight: 45-75% of silver powder, 2-10% of glass powder, 20-50% of organic carriers and 0-3% of inorganic additives. The chip component termination electrode manufactured by the electrocondution slurry can reduce thickness of a silver layer obviously, thus reducing manufacturing cost of a chip component obviously.

Description

technical field [0001] The invention relates to a conductive paste for terminal electrodes of chip components. More specifically, the invention relates to a silver conductive paste used for terminal electrodes of chip components, which can significantly reduce the thickness of the silver layer and significantly reduce the manufacturing cost of the chip components. Background technique [0002] Usually, when manufacturing chip components, such as chip ceramic capacitors and multilayer chip inductors, it is necessary to coat both ends of the sintered ceramic body with conductive paste. The coating process usually adopts the method of dipping and then drying , Sintered to form terminal electrodes. In order to improve the welding performance, a metal layer, such as nickel plating and tin plating, is generally plated on the terminal electrode. [0003] The above-mentioned conductive paste is mainly composed of metal powder, glass powder, and organic carrier, wherein the metal p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22
Inventor 廖晓峰
Owner 廖晓峰
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