A powder metallurgy preparation method of fine-grain diamond-copper-based composite heat dissipation material

A copper-based composite and powder metallurgy technology, applied in the field of powder metallurgy, can solve the problems of large number of pores, lower thermal conductivity of heat sink, and inability to fill metal materials, so as to improve sintering density and solve engineering application problems.

Active Publication Date: 2022-03-04
JILIN UNIV
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AI Technical Summary

Problems solved by technology

At present, the technical achievements (such as discharge plasma sintering method, SPS method) of diamond / copper heat dissipation materials prepared by powder metallurgy method and fine particle coating diamond (120 / 140 mesh, 325 / 400 mesh) have also been reported (thermal Conductivity is about 650W / mK), but it is currently limited to the preparation of test samples and cannot be applied to mass device production
At the same time, when the diamond / copper composite heat dissipation material is prepared by powder metallurgy technology, fine-grained diamonds are easy to aggregate during the mixing and sintering process, resulting in the failure or insufficient filling of the metal material between the diamond particles in the aggregation area. The density of the body is insufficient, which greatly reduces the thermal conductivity of the heat sink; therefore, when using fine-grained diamond, it must be considered that it can be effectively dispersed to prevent aggregation, and the existing technology is difficult to effectively solve this problem
[0005] In summary, the existing preparation methods are difficult to prepare thin sheet heat dissipation materials at low cost and in batches. In order to overcome the shortcomings of the existing technology, it is urgent to develop a thin diamond / copper heat dissipation substrate that uses fine-grained diamond and can be mass-produced in batches. preparation technology

Method used

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Examples

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preparation example Construction

[0026] A powder metallurgy preparation method for a fine-grained diamond-copper-based composite heat dissipation material, comprising the following steps:

[0027] S1: Weighing according to weight percentage: 4.2-11.6% by weight of fine-grained diamond, 1-5% by weight of water atomized ultrafine CuSn15 bronze powder, 0.1-0.5% by weight of composite nickel / copper carbon fiber / silicon carbide whisker, 1.5-3.0% by weight polyvinylpyrrolidone alcohol solution, and the balance is electrolytic copper powder;

[0028] S2: Cold compacting: the raw material powder is mixed and granulated with K90 alcohol solution as a granulation binder, and then cold pressed into a sheet-shaped green body in a steel mold;

[0029] S3: High-temperature reduction pre-sintering: put the cold-pressed tablet into a hydrogen reduction furnace for high-temperature reduction pre-sintering;

[0030] S4: High-temperature and high-pressure densification sintering: put the pre-reduced sintered body into a graphi...

Embodiment 1

[0041] A four-column hot-press sintering machine was used to prepare a sheet-shaped diamond / copper composite heat dissipation substrate with a specification of 15mm (length) × 15mm (width) × 1mm (thickness), a total of 160 pieces, 16 pieces / mold (4 layers of material / mold, Single charge 4 slices). Wherein, the design addition amount of diamond is described by volume concentration (adding 4.4 carat diamond in 1 cubic centimeter volume, is defined as 100% volume concentration), when actually dropping into diamond, convert to weight after conversion according to the design volume concentration. In the present embodiment, composite titanium / nickel plating (titanium plating weight gain is 0.3%, nickel coating weight gain is 20%) diamond mass ratio is 7.7% (corresponding design volume concentration is 60%), The mass proportion of ultrafine CuSn15 powder is 1%, the weight proportion of composite nickel / copper-coated carbon fiber (length 74 μm) is 0.5%, and the balance is electrolytic...

Embodiment 2

[0065] Densification sintering was carried out using a six-sided top press to prepare a diamond / copper heat dissipation substrate with the same specifications and proportions as in Example 1.

[0066] Take steps (1) to (4) in Example 1 to prepare a pre-reduced sintered diamond / copper heat sink;

[0067] Place the above-mentioned pre-reduced sintered sheets in the pyrophyllite assembly block, 10 pieces / group, and use graphite with a thickness of 2mm as the spacer between the sheets, and sinter and densify at high temperature and high pressure in a six-sided top press, at a temperature of 950°C , Keep warm for 3 minutes at a pressure of 4.5GPa, remove the mold and pick up the parts after natural cooling;

[0068] The workpiece is fixed on the rotary polishing device, and the soft polishing cloth with short-pile fiber and the polishing liquid are used for polishing with water as the medium, and then the polished workpiece is ultrasonically cleaned in industrial alcohol solution a...

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Abstract

The invention discloses a powder metallurgy preparation method for a fine-grained diamond copper-based composite heat dissipation material, comprising the following steps: S1: weighing according to weight percentage: fine-grained diamond with a weight percentage of 4.2-11.6%, and a weight percentage of 1-11.6% 5% of water atomized superfine CuSn15 bronze powder, 0.1-0.5% by weight of composite nickel / copper-plated carbon fiber / silicon carbide whisker, and the balance of electrolytic copper powder. The present invention is a powder metallurgy production technology for preparing a composite heat dissipation substrate with thermal conductivity > 550W / mK by mixing fine-grained diamond and copper powder and then sintering twice. It has the characteristics of low cost, stable process and quantifiable production. , which can solve the engineering application difficulties that the existing technology is difficult to quantitatively produce heat dissipation substrates with a thickness of ≤2mm.

Description

technical field [0001] The invention relates to the technical field of powder metallurgy, in particular to a powder metallurgy preparation method of a fine-grain diamond-copper-based composite heat dissipation material. Background technique [0002] With the rapid development of electronic technology, modern electronic and optoelectronic devices are increasingly miniaturized, highly integrated, and high-powered, and the heat dissipation performance requirements of electronic devices are getting higher and higher. Copper is a metal with good thermal conductivity, while diamond conducts heat by phonons, and its thermal conductivity can reach 1500-2600W / mK at room temperature, which is about 5 times that of copper. Therefore, diamond / copper composite heat dissipation material is an ideal new type of electronic Packaging materials have received extensive attention in recent years. [0003] At present, the preparation of diamond / copper composite materials mainly includes solid-p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C47/14C22C47/04C22C49/02C22C49/14C22C101/10C22C101/14
CPCC22C47/14C22C47/04C22C49/02C22C49/14
Inventor 董书山徐航董欣然孙贵乾姜丽娜陶强朱品文
Owner JILIN UNIV
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