The invention relates to a reversal copper foil production process, belonging to the technical field of electrolytic copper foils. The process comprises electrolysis of raw foil and surface treatment,wherein the surface treatment comprises microetching, acid pickling, roughening, washing, curing, washing, roughening, washing, curing, washing, surface alloying treatment, washing, surface anti-oxidation treatment, washing, passivation, applying of an anti-sticking film on a rough surface, silanization treatment, and drying; the applied anti-sticking film comprises the following components according to the weight percentage: 35.5-46 wt% of organochlorosilane, 27.8-33 wt% of organopolysiloxane resin, 12.7-20.1 wt% of aminosilane, 10.2-12.2 wt% of polyester resin, and 2-8.2 wt% of acid carclazyte catalyst; and the applied anti-sticking film has the thickness of 3 micrometers. The production process can reduce the residual copper rate on the surface of a copper foil while ensuring the bonding force between the surface of the copper foil and an etching resist, and ensures the elongation rate of the copper foil.