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Mixed additive for removing internal stress of electrolytic copper foil and method for producing low-stress copper foil

A technology of mixed additive and electrolytic copper foil, applied in the field of mixed additive, can solve the problems of increased surface roughness, difficulty, decreased tensile strength and elongation, etc., to achieve the effect of easy control of production process and stable product quality

Active Publication Date: 2013-06-26
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, it will lead to a significant decrease in tensile strength and elongation and an increase in surface roughness
[0005] In the actual production of electrolytic copper foil, we found that the higher the purity of the electrolyte, the smaller the internal stress of producing copper foil, but it is very difficult to maintain a high-purity electrolyte

Method used

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  • Mixed additive for removing internal stress of electrolytic copper foil and method for producing low-stress copper foil
  • Mixed additive for removing internal stress of electrolytic copper foil and method for producing low-stress copper foil
  • Mixed additive for removing internal stress of electrolytic copper foil and method for producing low-stress copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] A mixed additive for eliminating the internal stress of electrolytic copper foil in this embodiment, the raw materials contained in each liter of mixed additive solution are:

[0048] Medium molecular weight gelatin (Glue) 1.5 mg with a molecular weight of 10,000-20,000, low molecular weight hydroxyethyl cellulose (HEC) with a molecular weight of 5,000-15,000 1.22 mg, and liquid additives were added at a speed of 85 ml / min.

[0049] The above liquid additives, each liter of solution contains:

[0050] Sodium dimercaptodipropane sulfonate (SPS) 0.3 g, sodium dimethyl-dithioformamide sulfonate (DPS) 0.2 g, polyethylene glycol (PEG) 0.1 g, ethylene thiourea (N) 0.06 g, five Amino tetrazolium (TA) 0.03 g and hydrochloric acid (HCl) 30 g, the raw materials used are of analytical grade;

[0051] The preparation method of above-mentioned liquid additive:

[0052] Take the preparation of 1L of the liquid additive as an example

[0053] 1), first take 200ml of water, add 0.1-...

Embodiment 2

[0061] The difference between this embodiment and embodiment 1 is:

[0062] A mixed additive for eliminating the internal stress of electrolytic copper foil in this embodiment, the raw materials contained in each liter of mixed additive solution are:

[0063] 1.8 mg of medium molecular weight gelatin (Glue) with a molecular weight of 10000-20000, 1.5 mg of low molecular weight hydroxyethyl cellulose (HEC) with a molecular weight of 5000-15000 and liquid additives, the liquid additives were added at a speed of 90 ml / min.

[0064] The above liquid additives, each liter of solution contains:

[0065] Sodium dimercaptodipropane sulfonate (SPS) 0.5 g, sodium dimethyl-dithioformamide sulfonate (DPS) 0.4 g, polyethylene glycol (PEG) 0.3 g, ethylene thiourea (N) 0.09 g, five Amino tetrazolium (TA) 0.06 g and hydrochloric acid (HCl) 40 g, the quality of the raw materials used are analytically pure.

Embodiment 3

[0067] The difference between this embodiment and embodiment 1 is:

[0068] A mixed additive for eliminating the internal stress of electrolytic copper foil in this embodiment, the raw materials contained in each liter of mixed additive solution are:

[0069] 2.6 mg of gelatin (Glue) with a molecular weight of 10,000-20,000, 2.5 mg of low molecular weight hydroxyethyl cellulose (HEC) with a molecular weight of 5,000-15,000, and liquid additives. The liquid additives are added at a speed of 100 ml / min.

[0070] The above liquid additives, each liter of solution contains:

[0071] Sodium dimercaptodipropane sulfonate (SPS) 0.2 g, sodium dimethyl-dithioformamide sulfonate (DPS) 0.5 g, polyethylene glycol (PEG) 0.06 g, ethylene thiourea (N) 0.03 g, five Amino tetrazolium (TA) 0.08 g and hydrochloric acid (HCl) 60 g, the quality of the raw materials used are analytically pure.

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Abstract

The invention relates to a mixed additive for removing internal stress of an electrolytic copper foil and a method for producing a low-stress copper foil and belongs to the technical field of production of a high-precision electrolytic copper foil. The mixed additive for removing internal stress of the electrolytic copper foil comprises gelatin, hydroxyethyl cellulose and liquid additive. The method for producing the low-stress copper foil by using the mixed additive comprises the steps of preparing high-purity cathode copper and sulfuric acid into mixed solution of sulfuric acid and copper sulfate at 60-95 DEG C under the condition of stirring in the presence of air, wherein Cu<2+> is 85-100g / L and H2SO4 is 100-120g / L; adjusting the temperature of electrolyte to 45-60 DEG C and the flow to 50-70m<3> / h; adding 20-50mg / L of Cl<->, adding the mixed additive, with a drum titanium tube which continuously rotates as a cathode and arc titanium as an anode, carrying out copper electrolytic deposition and lastingly stripping to obtain 12-70 microns copper foil under the condition of the direct current of which the current density is 55-70A / dm<2>. The thickness of the copper foil is controlled by adjusting the rotation speed of the cathode; and the obtained copper foil has excellent performances.

Description

technical field [0001] The invention relates to a mixed additive for eliminating internal stress of electrolytic copper foil and a method for producing low-stress copper foil, belonging to the technical field of high-precision electrolytic copper foil production technology. Background technique [0002] With the increasing amount of various types of information processing, people have put forward higher and higher requirements for the information processing capabilities of electronic products. As an important part of electronic products, printed circuit boards (PCBs) require high reliability substrate materials. Excellent properties such as high moisture resistance, high heat resistance, high dielectric properties, and high dimensional stability. As the basic raw material of printed circuit board (PCB) and copper clad laminate (CCL), electrolytic copper foil needs to meet the normal temperature (23°C), high temperature (180°C) elongation, peel strength and other properties, ...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D7/06
Inventor 杨祥魁徐策王其伶刘建广马学武李忠洋王涛
Owner SHANDONG JINBAO ELECTRONICS
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