The invention discloses a
sapphire wafer polishing method based on fixed
abrasive tool containing
neodymium compounds and soft
abrasive materials. The method comprises the steps that 1), the fixed
abrasive tool containing the
neodymium compounds and the soft abrasive materials is prepared by comprising, 40%-60% of
nano silicon dioxide, 20%-40% of a binding agent, 10%-15% of a curing agent, 5%-10%of a
neodymium compound, and the balance deionized water; 2), the prepared raw materials undergo hot-press forming in a mould,
heat curing is completed after demolding is carried out, and the upper end surface and the lower end surface of the formed abrasive tool are trimmed; 3), the abrasive tool is arranged on a
polishing machine upper disc, a
sapphire wafer to be machined is placed on a
polishing machine lower disc capable of rotating and is fixed by a clamp, then a polishing
machine is started, a water-based cooling liquid is injected between the upper disc and the lower disc, the neodymium compounds and the
silicon dioxide abrasive particles on the abrasive tool scratch the
sapphire surface and the
solid-
phase reaction is carried out, so that the
sapphire wafer is polished. Accordingto the method, the removal rate of the
sapphire wafer can be improved, the roughness can be reduced, the
machining efficiency can be improved, and the production cost can be reduced.