The invention relates to a manufacturing process of an HDI (
High Density Interconnection) board. The manufacturing process comprises the following steps of: A, carrying out
browning treatment on a multilayer circuit board so that a browned film is formed on the surface of a
copper foil layer, and carrying out
laser hole drilling on the surface of the
copper foil to form
laser blind holes; B, carrying out hole drilling on the multilayer circuit board through a
drill bit to form mechanical
drill holes; C, carrying out outer-layer
copper precipitation on the multilayer circuit board so that copper
layers are formed in the
laser blind holes and the mechanical
drill holes, and carrying out
electroplating treatment on the multilayer circuit board, so that the copper coppers in the laser blind holes and the mechanical drill holes are thickened; and D, carrying out outer-layer pattern making on the multilayer circuit board, and carrying out pattern
electroplating, outer-layer
etching, silk-screen
mask soldering and surface treatment to obtain the HDI board as a finished product. Compared with the prior art, the manufacturing process disclosed by the invention has the advantages of avoiding processes, such as outer-layer copper
precipitation, board
electroplating, outer-layer pattern hole-electroplating, porefilling electroplating, mold stripping, board
grinding with an
abrasive belt and the like which are adopted after laser hole drilling, greatly shortening
production cycle and reducing production cost; meanwhile, according to the manufacturing process disclosed by the invention, because the process of
grinding the board with the
abrasive belt is not required, size stability of the circuit board is relatively better, and the circuit board cannot deform.