516 results about "Vinylsilane" patented technology

An electronic device module comprising:A. At least one electronic device, e.g., a solar cell, andB. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene-based polymer composition characterized by a Comonomer Distribution Constant greater than about 45, more preferably greater than 50, most preferably greater than 95, and as high as 400, preferably as high as 200, wherein the composition has less than 120 total unsaturation unit / 1,000,000C, preferably the ethylene-based polymer compositions comprise up to about 3 long chain branches / 1000 carbons, more preferably from about 0.01 to about 3 long chain branches / 1000 carbons; the ethylene-based polymer composition can have a ZSVR of at least 2; the ethylene-based polymer compositions can be further characterized by comprising less than 20 vinylidene unsaturation unit / 1,000,000C; the ethylene-based polymer compositions can have a bimodal molecular weight distribution (MWD) or a multi-modal MWD; the ethylene-based polymer compositions can have a comonomer distribution profile comprising a mono or bimodal distribution from 35° C. to 120° C., excluding purge; the ethylene-based polymer compositions can comprise a single DSC melting peak; the ethylene-based polymer compositions can comprise a weight average molecular weight (Mw) from about 17,000 to about 220,000, (2) optionally, a vinyl silane, (3) optionally, a free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (4) optionally, a co-agent.

The invention discloses a preparation method and an application of main chain fracture type polyacrylic acid silane ester resin. The method comprises the following steps of: mixing a cyclic monomer, a vinyl monomer and a vinyl silane ester monomer in a solvent according to a proportion, and then, adding a composite initiator accounting for 0.01-5% of the total mass percent of the monomers, and reacting at a temperature of 25-150 DEG C under the protection of argon or nitrogen to prepare the main chain fracture type polyacrylic acid silane ester resin; and the monomers are composed of 5-95wt% of cyclic monomer, 0-90wt% of vinyl monomer and 5-95wt% of vinyl silane ester monomer. According to the resin obtained by the invention, the side chain silane ester can hydrolyze under the action of seawater and the polyester chain segment of a main chain can generate chain scission under the action of seawater, thereby solving the dependence of traditional self-polishing materials on navigational speed, effectively regulating and controlling a stain-proofing agent to release at a constant speed, maintaining active substances on the coating surface of a ship and well meeting the anti-fouling requirements of ships, submarines and offshore production platform facilities with low navigational speeds.

A process for copolymerizing ethylene with vinylsilanes is disclosed. The process uses a Ziegler-Natta catalyst and cocatalyst wherein the Ziegler-Natta catalyst is prepared from a Group 4-6 halogen-containing transition metal and a mixture of an organomagnesium compound and a silicon-containing compound. Silane-functionalized polyolefins produced using the process can be crosslinkable and can be used to bond polyolefins to polysiloxanes or other functionalized polymers.

Provided is a novel organosilicon compound which functions as a silane coupling agent (wetter) that enables a silicone to be filled with a large quantity of a filler.The organosilicon compound is represented by a general formula (1)wherein, R1 represents a hydrogen atom, or an unsubstituted or substituted monovalent hydrocarbon group, R2 to R4 represent identical or different unsubstituted or substituted monovalent hydrocarbon groups, each R5 represents, independently, a hydrogen atom, or an unsubstituted or substituted monovalent hydrocarbon group, each R6 represents, independently, an identical or different unsubstituted or substituted monovalent organic group, m represents an integer from 0 to 4, and n represents an integer from 2 to 20; as well as a method of producing the above organosilicon compound, wherein a one end organohydrogensilyl-terminated organopolysiloxane is produced by reacting an organohydrogensiloxane with a vinylsilane or an alkenyltriorganooxysilane in the presence of a hydrosilylation catalyst, and optionally this one end organohydrogensilyl-terminated organopolysiloxane is then reacted with an alkene in the presence of a hydrosilylation catalyst.

A process for preparing a phase change microcapsule having a thermally conductive shell is introduced. The thermal conductivity of the encapsulation materials for the phase change microcapsules is increased by adding thermally conductive nano-materials. The vinylsilane compound is polymerized with the acrylic monomer to form the copolymer first, and then the thermally conductive inorganic material is added. Thereafter, the phase change microcapsule having the phase change material as the core and the thermally conductive material-containing copolymer as the shell is prepared. The polar functional groups on the surface of the thermally conductive inorganic material condense with the vinylsilane compound to form chemical bonding, thereby substantially increasing the compatibility between the thermally conductive inorganic material and the copolymer. Therefore, the thermally conductive material can be dispersed stably during the encapsulation of the microcapsules, and the phase change microcapsule having the thermally conductive shell can be obtained successfully.