The invention discloses soldering flux for improving the film-forming property. The soldering flux is prepared from 10-20 parts of activating agent, 2-6 parts of surface active agent, 0.3-0.8 part of cosolvent, 0.2-2 parts of film-forming agent, 0.04-0.09 part of corrosion inhibitor, 1-4 parts of antioxidant and the balance of deionized water, wherein the film-forming agent is prepared from at least one of PEG-1000, PEG-2000, PEG-4000 and PEG-6000, the surface active agent is prepared from at least one of FMEE and lutensol to (3,5,7,9) compounds, BTA and BIA are mixed to form the corrosion inhibitor, the antioxidant is prepared from at least one of tertiary butylhydroquinone, triclosan, tetrachloroisophthalonitrile and allicin, and the activating agent is prepared from at least two of glutaric acid, DL-malic acid, methylsuccinic acid and itaconic acid. With the method, the soldering flux for improving the film-forming property has the advantages of being free of halogen, low in residue, free of washing, environmentally friendly and the like.