The invention discloses a protective film for
chip cutting. The protective film sequentially comprises a releasing layer, a substrate layer and an
adhesive layer, wherein the substrate layer is made of modified PO (propylene
epoxide) material; the modified PO material is prepared by copolymerizing PP (
polypropylene) and PE (
polyethylene); the modified PO material is prepared from the following components in parts by weight: 50 to 70 parts of PP, 20 to 40 parts of PE, and 5 to 10 parts of talcum
powder. The protective film has the characteristics that the substrate layer adopts the modified POmaterial, so that the
mechanical strength is high, the
halogen is avoided, and the environment-friendly requirement is met; the heat-resistant property is better, and the certain high-temperature operation requirement is met; the
plasticizer is not contained, so that the risk of micromolecule segregation is avoided for the material; the material strength is high, the
ductility is good, the uniformshrinkage rate in each direction is maintained under the condition of 140% of elongation rate, and the uniform strength in each direction is realized at the premises of certain elongation rate; the
adhesive layer uses pressure-sensitive
adhesive to replace the photo-sensitive adhesive and thermo-sensitive adhesive, the transparency degree is high, the weather-resistant property is high, TG is about -20 DEG C, and the procedures are simple (no UV (
ultraviolet) furnace passing or reheating procedure); by performing simple laminating and separating, the product application requirement can be met, the change of
viscosity duration is small and is less than 20%, and the residual adhesive is avoided.