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Flexible halogen-free high-thermal conductivity resin-coated copper foil and preparation method thereof

A technology of resin copper foil and halogen resin, which is applied in the field of flexible halogen-free high thermal conductivity resin-clad copper foil and its preparation, can solve the problems that cannot meet the needs of flexible copper-clad laminates, and achieve excellent performance, wide application, and excellent thermal conductivity.

Inactive Publication Date: 2012-09-05
GUANGZHOU GRACE ELECTRON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the development of the electronics industry, the power and calorific value of electronic components mounted on copper-clad laminate materials are increasing. In order to ensure the stability of the overall component performance, the copper-clad laminate materials used to install electronic components require good thermal conductivity, and At present, the thermally conductive resin layer used in metal-based rigid copper-clad laminates is often hard and brittle after curing, which cannot meet the needs of flexible copper-clad laminates that must have good flexibility.

Method used

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  • Flexible halogen-free high-thermal conductivity resin-coated copper foil and preparation method thereof
  • Flexible halogen-free high-thermal conductivity resin-coated copper foil and preparation method thereof
  • Flexible halogen-free high-thermal conductivity resin-coated copper foil and preparation method thereof

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specific Embodiment 2

[0062] The difference between specific embodiment 2 and specific embodiment 1 is: the halogen-free thermosetting glue applied in specific embodiment 2, in terms of solid weight percentage, its composition is: phosphorus-containing epoxy resin 20%, curing agent dicyandiamide Amine 1%, acetone 35%, curing accelerator 2-ethyl-4-methylimidazole 0.3%, carboxyl-terminated butadiene acrylonitrile rubber 5%, aluminum oxide 38.7%.

specific Embodiment 3

[0063] The difference between the specific embodiment 3 and the above specific embodiment is that the halogen-free thermosetting glue applied in the specific embodiment 3 is composed of: 20% phosphorus-containing epoxy resin, and the curing agent dicyandiamide Amine 1%, acetone 35%, curing accelerator 2-ethyl-4-methylimidazole 0.3%, carboxyl-terminated butadiene acrylonitrile rubber 10%, aluminum oxide 33.7%.

specific Embodiment 4

[0064] The difference between specific embodiment 4 and the above specific embodiment is that: the halogen-free thermosetting glue applied in specific embodiment 4, in terms of solid weight percentage, its composition is: 25% of phosphorus-containing epoxy resin, curing agent dicyandiamide Amine 1%, acetone 35%, curing accelerator 2-ethyl-4-methylimidazole 0.3%, carboxyl-terminated butadiene acrylonitrile rubber 5%, silicon carbide 33.7%.

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Abstract

The invention provides a flexible halogen-free high-thermal conductivity resin-coated copper foil comprising a copper foil and a halogen-free resin layer located on one surface of the copper foil, wherein the halogen-free resin layer is prepared by utilizing a halogen-free thermosetting glue solution which comprises the following components in percentage by solid weight: 10-40% of flame-retardant epoxy resin, 0.1-8% of curing agent, 0.01-0.5% of curing accelerator, 5-20% of rubber, 20-40% of solvent and 30-60% of padding. The invention also provides a method for manufacturing the flexible halogen-free high-thermal conductivity resin-coated copper foil by using the resin glue solution prepared through the formula. The flexible halogen-free high-thermal conductivity resin-coated copper foil manufactured by using the formula and the manufacturing method provided by the invention has the characteristics of folding resistance, high flexibility, excellent heat-conducting property, green and environmental protection, no halogen and flame retardance and can be suitable for the preparation of not only metal-based flexible copper clad laminates but also metal-based rigid copper clad laminates.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, and more specifically relates to a flexible halogen-free high thermal conductivity resin-clad copper foil and a preparation method thereof. Background technique [0002] Copper-clad laminates are made by soaking electronic glass fiber cloth or other reinforcing materials with the resin glue that has been prepared, or evenly coating the surface with resin glue, and then covering one or both sides with copper foil and undergoing hot pressing and curing processes. made of a composite material. Flexible copper-clad laminate (that is, flexible copper-clad laminate) refers to one or both sides of flexible insulating materials such as polyester film or polyimide film, which are bonded together with resin adhesive and copper foil through a certain process. The formed copper clad laminate. Resin-clad copper foil is widely used in the production of metal-based copper-clad laminates and prin...

Claims

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Application Information

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IPC IPC(8): B32B15/092B32B15/20C08L63/00C08G59/20C08G59/50
Inventor 李海民施忠仁李宏途周宁何益良
Owner GUANGZHOU GRACE ELECTRON CORP
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