The invention relates to the field of
semiconductor preparation, in particular to a method for preparing an ONO medium layer. The method is suitable for a nonvolatile NOR flash memorizer. The method includes the following steps of firstly, providing a
silicon wafer, wherein a surface tunneling
oxide layer and a floating gate layer formed at a preset position are sequentially arranged on a substrate of the
silicon wafer; secondly, inputting first preset reaction gas through an in-situ vapor
generation process, and forming bottom layer
silicon oxide on the upper face of the floating gate layer; thirdly, inputting second preset reaction gas through a porous
quartz tube, and forming
silicon nitride on the upper side of the bottom layer
silicon oxide through deposition; fourthly, inputting the first preset reaction gas through the in-situ vapor
generation process, and oxidizing the surface of the
silicon nitride to form top layer
silicon oxide. The method has the advantages that the thickness uniformity of a thin film depositing on the surface of the silicon
wafer is effectively improved, shells produced by the silicon wafer is remarkably reduced, N type dopes are not prone to being formed on contact faces of the
silicon oxide and the silicon wafer,
realizability is high, and the method can be widely applied to various deposition processes.