The invention provides a method of improving buried resistance printed wire board resistance precision. The method of improving the buried resistance printed wire board resistance precision comprises the following steps: (1) supplying a board with a buried resistance layer, wherein the board with a buried resistance layer comprising an insulating medium layer, the buried resistance layer and a
copper foil layer, (2) attaching a
first light resistance film, proceeding a first time
exposure, printing a circuit figure of a negative film on the
first light resistance film, proceeding a first time develop, the circuit figure comprising a resistance circuit and a normal circuit, increasing 6 mil to a long side unilateral of circuit width of the resistance circuit, and increasing 1.25 mil to a broadside unilateral of circuit width of the resistance circuit, (3) proceeding a first time
etching and a second time
etching, (4) attaching a second light resistance film, proceeding a second time
exposure, printing a circuit figure of a positive film on the second light resistance film, proceeding a second time develop, reducing 0.6 mil to a long side unilateral of circuit width of the resistance figure, and increasing 6 mil to a broadside unilateral of circuit width of the resistance figure, (5) proceeding a third time
etching, and (6) proceeding brown
oxide processing, controlling micro etching amount between 1.3-1.7um,proceeding a -17% extra compensation to the resistance figure of the positive film.