Method of improving buried resistance printed wire board resistance precision

Abstract

The invention provides a method of improving buried resistance printed wire board resistance precision. The method of improving the buried resistance printed wire board resistance precision comprises the following steps: (1) supplying a board with a buried resistance layer, wherein the board with a buried resistance layer comprising an insulating medium layer, the buried resistance layer and a copper foil layer, (2) attaching a first light resistance film, proceeding a first time exposure, printing a circuit figure of a negative film on the first light resistance film, proceeding a first time develop, the circuit figure comprising a resistance circuit and a normal circuit, increasing 6 mil to a long side unilateral of circuit width of the resistance circuit, and increasing 1.25 mil to a broadside unilateral of circuit width of the resistance circuit, (3) proceeding a first time etching and a second time etching, (4) attaching a second light resistance film, proceeding a second time exposure, printing a circuit figure of a positive film on the second light resistance film, proceeding a second time develop, reducing 0.6 mil to a long side unilateral of circuit width of the resistance figure, and increasing 6 mil to a broadside unilateral of circuit width of the resistance figure, (5) proceeding a third time etching, and (6) proceeding brown oxide processing, controlling micro etching amount between 1.3-1.7um,proceeding a -17% extra compensation to the resistance figure of the positive film.

Description

technical field [0001] The invention relates to a buried element type printed circuit board, in particular to a method for improving the resistance value precision of a buried resistor printed circuit board. Background technique [0002] In order to improve the assembly density and performance of products and reduce the volume and weight of products, it is an effective way to integrate passive components into circuit boards, so printed circuit boards with buried resistors emerge as the times require. Buried resistance printed circuit boards have the following advantages in the design of high-speed transmission circuits: improve the impedance matching of the line, shorten the path of signal transmission, reduce parasitic inductance, eliminate the inductance generated in the surface mount or plug-in process, and reduce signal crosstalk , noise and electromagnetic interference. [0003] Buried resistance printed circuit boards often use buried resistance ink (TU-XX-08 series o...

AI Technical Summary

Problems solved by technology

[0003] Buried resistance printed circuit boards often use buried resistance ink (TU-XX-08 series of Asahi) as buried resistance for processing. Due to the limitation of silk screen printing process and equipment, small-sized resistors cannot be made, and the resistance line width must be greater than 15mil; at the same time Screen printing production is extremely difficult, with poor precision, poor reproducibility, and poor stability. Under the current production conditions, the promotion of this process is slow, and most of them are in the stage of prototype and small batch production.

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