Resistance wiring board and its mfg. method

A manufacturing method and wiring board technology, which is applied in the direction of resistance manufacturing, printed circuit manufacturing, resistors, etc., can solve the problems of height reduction, installation difficulty, thermal conductivity reduction of insulating substrate, etc., and achieve the effect of height reduction

Inactive Publication Date: 2006-10-11
PANASONIC CORP
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the surface of the electrode or the surface of the resistor body is located at a higher position than the surface of the insulating substrate, which hinders the problem of reducing the height of the resistor wiring board.
[0007] In addition, in the case of using a resistor wiring board as a chip resistor, in order to increase the component mounting density, although the face-down method of mounting the electrode surface on the green sheet surface is advantageous, as mentioned above, in the conventional method, the surface of the resistor body is damaged. Located at a position higher than the electrode surface, so mounting based on the face-down method is difficult
[0008] In addition, as long as the resistor is provided in the pit, the thickness of the resistor will vary, or it will be difficult to fill the resistor to the end of the pit, so there is a problem that the resistance value will vary.
[0009] In addition, when a low-temperature sintered substrate such as glass alumina is used for simultaneous sintering with the electrodes in order to reduce the height of the resistor wiring board, the thermal conductivity of the insulating substrate will decrease, and there will be problems such as overloading due to heat generation of the resistor.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resistance wiring board and its mfg. method
  • Resistance wiring board and its mfg. method
  • Resistance wiring board and its mfg. method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The resistance wiring board of Example 1 of the present invention can be obtained by a manufacturing method comprising the following steps: using a doctor blade method to mix and disperse aluminum powder and additives shown in Table 1, butyral resin, plasticizer, and solvent to obtain The paste, the first step of forming a green sheet, on the green sheet obtained by the first step, use the Pd-Ag paste of the composition shown in Table 1 and use the second step of screen printing to form an electrode pattern, and use the method to obtain a dense sintered substrate. The temperature of the sheet is the third step of sintering the green sheet obtained in the second step. After printing a ruthenium oxide series resistor paste as a resistor material between the electrodes on the sintered body obtained in the third step, print a resistive protective film. The fourth process of sintering the glass paste at 650°C.

[0026] Use Pd-Ag series or Pd electrodes containing more than 6...

Embodiment 2

[0032] The resistance wiring board of Example 2 of the present invention can be obtained by a manufacturing method comprising the following steps: using a doctor blade method to mix aluminum: TiO2: MnO: SiO2 in a weight ratio of 94:2:2:2 Raw material powder and butylated The paste obtained by mixing and dispersing an aldehyde resin, a plasticizer, and a solvent to form a green sheet is the first step. On the green sheet obtained by the first step, a Pd paste is used to form an electrode pattern by screen printing. The second step is to The third step is to form a 40 μm-deep step between the electrode patterns on the green sheet obtained in the second step, and the fourth step is to sinter the molded body obtained in the third step at a temperature capable of obtaining a dense sintered substrate. In the step, the step on the sintered body obtained in the fourth step is filled with ruthenium oxide series resistor paste and glass paste, and then the fifth step is sintering at 650°...

Embodiment 3

[0040] The resistance wiring board of Example 3 of the present invention can be obtained by a manufacturing method including the following steps: a paste obtained by mixing and dispersing raw material powder having the same composition as that of Example 2, a plasticizer, and a solvent by the doctor blade method , the first process of forming a green sheet, on the green sheet obtained by the first process, use Pd paste and use the second process of screen printing to form an electrode pattern, and form a step difference of 40 μm depth by the forming mold, so that the obtained in the second process The third step in which the electrode pattern on the green sheet overlaps the bottom surface of the step, the fourth step in which the molded body obtained in the third step is sintered at a temperature capable of obtaining a dense sintered substrate, and the sintered body obtained in the fourth step The fifth step of sintering is performed at 650°C after filling the ruthenium oxide s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a resistance wiring board and a manufacturing method thereof. A step difference pattern is formed between electrode patterns formed on a green sheet, and the step difference pattern is filled with a resistance paste and sintered. In addition, in order to improve the thickness accuracy of the resistor body (3), by grinding the surface of the resistor wiring board, the height of the surface of the electrode (1) and the surface of the resistor body (3) can be made to be the same as that of the surface of the insulating substrate (2). The height is the same or lower, and the height is reduced. Use the green sheet that comprises the TiO2 of 1.5~2.5wt% and the MnO of 1.5~2.5wt% and the SiO2 of 1.5~4.5wt% as the substrate material, constitute the electrode with the Pd-Ag electrode paste that comprises more than 60wt%, so can not Loss thermal conductivity and can simultaneously sinter the substrate material and electrode paste together. The present invention can realize the resistor wiring board for low height, high precision of resistance value and good overload characteristic.

Description

[0001] This application is a divisional application of the patent application No. 98800845.9 filed on June 12, 1998. technical field [0002] The present invention relates to various electronic components. In particular, it relates to a resistor wiring board used in chip resistors and the like, and a method for manufacturing the same. Background technique [0003] Such as Figure 8 As shown, after printing an electrode paste such as silver (Ag) on ​​the insulating substrate 4 after sintering alumina at about 1600°C, sintering at about 850°C to form an electrode 5, and then printing a resistance paste such as RuO2, The glass paste for the insulating protective film is sintered at about 650°C to form the resistor body 6 to obtain a conventional resistor wiring board [0004] On the other hand, the pattern is formed by printing electrode paste and resistor paste on the green sheet of the low-temperature sintering substrate such as glass alumina, and sintered at about 900°C to ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01C7/00C04B35/10H01C1/012H01C17/06H01C17/065H01C17/28H05K1/16H05K3/10
CPCH01C17/06533H01C17/281H05K1/167H05K3/107
Inventor 犬敦富岡聰志古川成男檜森剛司木村涼
Owner PANASONIC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap