333 results about "Plasma activation" patented technology

The invention provides a method for manufacturing a circuit board layer-adding structure. Manufacture of a fine circuit with the width smaller than 50 micrometers is achieved, use of insulation materials with high cost is avoided, so that the process cost of a substrate is reduced, and therefore cost of the substrate is reduced. The method comprises the following steps that (1) an inner-layer circuit is manufactured; (2) copper foil and prepreg are pressed and solidified; (3) laser drilling is conducted; (4) smear removal is conducted; (5) surface copper is removed; (6) plasma activating treatment is conducted on the surface of a circuit board; (7) electroless copper plating is conducted; (8) photoetching is conducted; (9) electroplating is conducted; (10) membrane stripping is conducted; (11) flash etching is conduced. According to the method, generally-used medium material PP is adopted; through the improvement of the SAP technical method, the chemical activity of the surface of the PP is improved, electroless copper plating is directly conducted on the surface of the PP, the binding force of an electroless copper plating layer is improved, so that the SAP machining requirements of the fine circuit are satisfied, and meanwhile the technical cost of the substrate is reduced to a great extent.

The invention discloses a method for preparing a composite interlayer coating film on the surface of engineering plastics, relates to a method for obtaining a metal composite layer on the surface of the engineering plastics and provides a method for preparing a composite interlayer coating film on the surface of engineering plastics, which can improve the function and the quality of metal-coated plastic products, reduce the production cost and is water-saving and environment-friendly because any aqueous solution is not needed in the whole processing flow. The method comprises the following steps of cleaning plastic blanks in a dry method, activating the plastic blanks, putting the activated plastic blanks into a PVD (Physical Vapor Deposition) furnace, plating a metal base film layer on the activated plastic blanks, spraying and plating an organic coating to the plastic blanks after plasma activation is carried out on the plastic blanks plated with metal base film layer, and finally putting the plastic blanks into PVD furnace to be plated with a metal facial film layer in order to obtain metalized engineering plastic products. The method is suitable for industries, such as bathroom accessories, electron, appliances, automobiles, and the like.

A continuous in situ process of deposition, etching, and deposition is provided for forming a film on a substrate using a plasma process. The etch-back may be performed without separate plasma activation of the etchant gas. The sequence of deposition, etching, and deposition permits features with high aspect ratios to be filled, while the continuity of the process results in improved uniformity.

The invention concerns a method of fabricating a composite substrate comprising at least one thin insulating layer interposed between a support substrate and an active layer of semiconductor material. The method comprises: providing a source substrate that comprises a semiconductor material and a support substrate; forming or depositing an insulating layer on the source substrate; providing recovery heat treatment of the insulating layer; providing plasma activation of a front face of the recovery heat treated insulating layer or a front face of the support substrate; molecular bonding, after the plasma activation, the front face of the insulating layer with the front face of the support substrate to form a bonded substrate; and lifting off a back portion of the source substrate from the bonded substrate to retain an active layer that comprises a remaining portion of the source substrate.