The invention discloses a method for preparing a
copper-
tungsten contact material by
discharge plasmas. The method comprises the following steps: 1, pouring
tungsten powder into a
graphite die, placing the
graphite die into a
plasma sintering furnace, performing vacuumizing and boosting, connecting the
sintering furnace with pulse
direct current, heating to 1,320 DEG C to 1,480 DEG C, preserving the heat for 2.5 to 5 min, and naturally cooling the
graphite die in the furnace to obtain
tungsten framework; 2,
polishing a
copper block, performing ultrasonic cleaning the
copper block until the copper block is cleaned, irradiating and scanning the copper block with
laser at the speed of 10 to 500 mm / s, and performing
plasma treatment to obtain an infiltrating copper block for later use; 3, putting the tungsten framework into a graphite boat, placing the infiltrating copper block on the tungsten framework, filling the space around the copper block with alundum
powder, putting the tungsten framework into a high-temperature
sintering furnace with protective gas
atmosphere, heating to 1,300 DEG C to 1,400 DEG C, and preserving the heat for 2 to 3 hours to obtain a copper-tungsten sintered body; and 4, performing vacuumizing
hot pressing on the copper-tungsten sintered body under conditions that the pressure is 50 to 100 MPa and the temperature is 800 DEG C to 850 DEG C, and cooling to
room temperature to obtain the copper-tungsten contact material.