3214results about How to "Reduce thermal stress" patented technology

An object of the present invention is to provide a honeycomb filter for purifying exhaust gases which makes it possible to alleviate a thermal stress generated due to occurrence of a local temperature change and which is less likely to generate cracks and superior in strength and durability, an adhesive that has a low thermal capacity and is capable of alleviating the thermal stress, a coating material that has a low thermal capacity with a superior heat insulating property and is capable of alleviating the thermal stress, and a manufacturing method of the honeycomb filter for purifying exhaust gases that can improve precision in the outside dimension, and reduce damages in the manufacturing processes.The present invention relates to a honeycomb filter for purifying exhaust gases, having a structure in that a plurality of column-shaped porous ceramic members, each having a number of through holes that are placed side by side in the length direction with partition wall interposed therebetween, are combined with one another through adhesive layers so that the partition wall that separate the through holes are allowed to function as a filter for collecting particulates, and in this structure, the thermal expansion coefficient αL of the adhesive layer and the thermal expansion coefficient αF of the porous ceramic member are designed to have the following relationship:0.01<|αL−αF| / αF<1.0.

A method of operating a gas turbine power plant and gas turbine power plant are disclosed wherein hydrogen for the combusting process is produced by feeding natural gas mixed with steam through a membrane / partial oxidation reactor and converting the natural gas at least to H2 and CO. Thereby oxygen is transferred from the compressed air through the membrane of the membrane / partial oxidation reactor and the oxygen is used for the partial oxidation process of the natural gas. The process is followed by converting the syngas in a CO shift reactor and a CO shift reactor to a CO2 removal equipment to mainly hydrogen.

Devices, systems and methods are provided for stimulation of tissues and structures within a body of a patient. In particular, implantable leads are provided which are comprised of a flexible circuit. Typically, the flexible circuit includes an array of conductors bonded to a thin dielectric film. Example dielectric films include polyimide, polyvinylidene fluoride (PVDF) or other biocompatible materials to name a few. Such leads are particularly suitable for stimulation of the spinal anatomy, more particularly suitable for stimulation of specific nerve anatomies, such as the dorsal root (optionally including the dorsal root ganglion).

A turbine airfoil support system for coupling together a turbine airfoil formed from two or more components, wherein the support system is particularly suited for use with a composite airfoil. In at least one embodiment, the turbine airfoil support system may be configured to attach shrouds to both ends of an airfoil and to maintain a compressive load on those shrouds while the airfoil is positioned in a turbine engine. Application of the compressive load to the airfoil increases the airfoil's ability to withstand tensile forces encountered during turbine engine operation.

Even when compression stress is generated because a volume of a thermal insulation layer 2 is expanded due to oxidized by oxygen in the air, occurrence of cracks and fractures of the thermal insulation layer and a heating conductor 3 caused by the cracks are prevented by dispersing the compression stress. A pressure wave generator comprises a substrate 1, the thermal insulation layer 2 of porous material which is formed on a surface of the substrate 1 in thickness direction, and the heating conductor 3 of thin film formed on the thermal insulation layer 2, and generates pressure waves by heat exchange between the heating conductor 3 and a medium. When a thickness at the center of the thermal insulation layer 2 in width direction W is used as a reference thickness, and it is assumed that distribution of thickness of thermal insulation layer in the width direction is averaged with the reference thickness, porosity in an outer peripheral portion of the thermal insulation layer is made smaller than porosity in the center portion. By making the porosity in the outer peripheral portion of the thermal insulation layer 2 smaller, a number of immovable points on the outer periphery of the thermal insulation layer 2 restricted by the substrate 1 is increased and the positions of them are dispersed, so that the compression stress compressed in the outer peripheral portion of the thermal insulation layer 2 can be dispersed.

Methods relating to the singulation of dice from semiconductor wafers. Trenches or channels are formed in the bottom surface of a semiconductor wafer, corresponding in location to the wafer streets. The trenches may be formed by etching or through an initial laser cut. The wafer is then singulated along the streets with a laser preferably having a beam narrower than the trenches. Multiple, laterally spaced lasers may be used in combination during a single pass to perform simultaneous singulating cuts. Additional edge protection for integrated circuitry on the active surface of the semiconductor dice may be provided by forming trenches or channels along the streets in the active surface instead of the bottom surface, disposing protective material along the streets and within the trenches prior to singulation and cutting through the wafer, leaving protective material on the sidewalls of the channels.

A surface-mounting choke coil has a resin coating material with magnetic powder which is filled a space between the upper flange and the lower flange of a drum-type ferrite core, while covering the circumferential of the winding. The resin coating material with magnetic powder has a glass transition temperature Tg of about −20° C. or lower, more preferably about −50° C. or lower in a course of transferring from a glass state to a rubber state during changing of shear modulus with respect to temperature as a physical property when hardening, and the thickness of the upper flange of the drum-type ferrite core is about 0.35 mm or less, and a value of a ratio L2 / L1 of an outer diameter L2 of the upper flange to a diameter L1 of the winding core of the drum-type ferrite core is about 1.9 or more.

A method involves pre-heating a workpiece to an intermediate temperature, heating a surface of the workpiece to a desired temperature greater than the intermediate temperature, and enhancing cooling of the workpiece. Enhancing cooling may involve absorbing radiation thermally emitted by the workpiece. An apparatus includes a first heating source for heating a first surface of a semiconductor wafer, a second heating source for heating a second surface of the semiconductor wafer, and a first cooled window disposed between the first heating source and the semiconductor wafer.