Preparation method of copper/graphite film multi-layer laminated blocky composite material

Abstract

The invention provides a preparation method of a copper / graphite film multi-layer laminated blocky composite material, which can be applied in the field of electronic packaging of an integrated circuit industry. The raw materials of the composite material adopt an anisotropic high-thermal-conductivity net-shaped graphite film and electrolytic pure copper powder. The preparation method comprises the following steps: adding the copper powder into a uniformly mixed solution of an adhesive prepared from polyvinyl butyral and an ethanol solution as well as dimethyl phthalate serving as a plasticizer, completely stirring to obtain uniform slurry with high flowability, spreading the slurry on the net-shaped graphite film uniformly, drying, cutting, degumming, superposing layer by layer, and performing bidirectional pressurizing and sintering to prepare the compact multi-layer laminated blocky composite material with the graphite film and metal copper which are arranged alternately in a layered mode. The heat conductivity of the composite material along the plane direction of the graphite film is 1.5 to 2 times higher than that of pure copper, the density can be reduced to be 65 to 80 percent of the density of the pure copper, and the composite material can be used for replacing the traditional copper tungsten metal heat-conducting material.

Description

technical field [0001] The invention relates to a method for preparing a copper / graphite film multilayer laminated block composite material, which provides a layered structure composite material prepared by using a highly thermally conductive reticular graphite film material as a raw material combined with a special molding and sintering process. The material can be used for heat dissipation of miniature electronic components, and belongs to the field of integrated circuits and electronic packaging materials. technical background [0002] The continuous progress of modern society has prompted the rapid development of electronic equipment. While requiring excellent performance, electronic equipment tends to be miniaturized and lightweight. This will inevitably lead to an increase in the heat generation per unit volume. If it cannot be dissipated in time, it may affect The equipment operates normally, or even damages the equipment. Traditional heat dissipation methods have be...

AI Technical Summary

Problems solved by technology

[0006] In order to improve the defects of the above-mentioned material properties, the present invention provides a method for preparing copper / graphite film multilayer laminated bulk composite material, which uses electrolytic pure copper powder and reticular graphite film as raw materials, and uses the casting method to process the copper powder slurry Spreading on the graphite film, the good fluidity of the slurry makes the copper powder fully fill the mesh of the graphite film, so the copper layers can be connected to each other to form a rivet structure, which solves the problem of low interlayer strength of the graphite film and copper The problem of not combining with the graphite film interface can effectively improve the strength of the composite material