562 results about "Copper matrix" patented technology

The invention belongs to the technical field of preparation of electronic packaging materials, and particularly designs a copper-based composite material with high thermal conductivity and a preparation method thereof. The copper-based composite material is made of a reinforcement and a binder through a prefabricated injection molding process to make a reinforcement prefabricated part, wherein the size of the reinforcement particle is 7-60 μm, and it is composed of silicon carbide particles, diamond particles or aluminum nitride particles. One or two of them; the copper matrix is ​​directly placed on the reinforcement preform, wherein the copper matrix is ​​electrolytic copper or oxygen-free copper, and the volume ratio of the reinforcement to the copper matrix is ​​50-75%: 25-50 %, made by pressure infiltration process. The preparation method adopts the injection molding process of the prefabricated part and the pressure impregnation process to prepare the high thermal conductivity copper matrix composite material. The thermal conductivity of the copper-based composite material in the present invention is higher than that of the aluminum-based composite material with the same reinforcement system, the material itself has low density and small thermal expansion coefficient, which meets the requirement of light weight of the packaging material.

The invention relates to a high heat-conducting copper-based composite material and a preparation method thereof, belonging to the technical field of electronic packaging materials. The copper-based composite material consists of 50-80 percent by volume of electroplated diamond particles and 20-50 percent by volume of copper. The electroplated diamond particles and a caking agent are mixed according to the volume ratio of 1:1-4:1 and are produced into a diamond prefabricated part by using an injection forming process of the prefabricated part; and a copper matrix is directly placed on the diamond prefabricated part or is melt and poured on the diamond prefabricated part to be produced into the high heat-conducting copper-based composite material by using a pressure infiltration process. The copper-based composite material has higher heat conductivity ratio than that of an aluminum-based composite material; by plating the surface of diamond, the interface bonding of the matrix copper and the diamond can be improved and the interface heat resistance can be reduced; in addition, the material has low density and small thermal expansion coefficient and meets the requirement for light quality of packaging materials.

A method for the fabrication of a double-sided electrical interconnection flexible circuit (200) particularly useful as a substrate for an area array integrated circuit package. A copper matrix with studs (203) is pressed through a dielectric film (201) having a copper layer on the opposite surface, thereby forming an intermediate structure for a flex circuit with self-aligned solid copper vias in a one step process. The contacts are reinforced by plating both surfaces with a layer of copper, and conventional processes are used to complete the circuit patterning.

To provide a composite material member for semiconductor device, an insulated semiconductor device and non-insulated semiconductor device using the composite material member, which are effective for obtaining a semiconductor device that alleviates thermal stress or thermal strain occurring during production or operation, has no possibilities of deformation, degeneration and rupture of each member, and is highly reliably and inexpensive. The composite material member for semiconductor device is characterized by being a composite metal plate with particles composed of cuprous oxide dispersed in a copper matrix, in which a surface of the composite metal plate is covered with a metal layer, and a copper layer with thickness of 0.5 mum or larger exists in an interface formed by the composite metal plate and the metal layer.

The invention discloses a graphene-aluminum oxide hybrid reinforced copper-based composite material. The composite material comprises 0.1-1.0 wt% of graphene, 1.0-1.2 wt% of Al2O3, and the balance copper. According to the copper-based composite material, the graphene and the aluminum oxide are adopted as complex-phase reinforcement bodies, zero-dimensional aluminum oxide particles can be effectively pinned through a special two-dimensional structure of a nano graphene sheet, a steric-hinerance effect is generated, accordingly, the agglomeration phenomenon of the particles is effectively reduced, and the particles are uniformly scattered; and the surface of the graphene is subjected to chemical nickel-plating and modification treatment, thus, the wettability and the interface bonding situation between the graphene/copper matrixes can be obviously improved, ideal interface bonding is achieved, accordingly, the synergistic effect between the graphene and the aluminum oxide particles is realized to the greatest extent, and the combination properties including strength, hardness, electrical conductivity, and friction and wear properties of the copper-based composite material are comprehensively improved.

The invention discloses a high-strength and high-conductivity heat-resistant Cu-Fe-Y-Mg alloy material with electromagnetic wave shielding performance and a preparation method thereof, and the copperalloy comprises Cu, Fe, Mg and Y elements; and the mass percentage of Fe is greater than or equal to 5% and is smaller than the mass percentage of Cu, and the Fe is uniformly distributed in the alloymaterial. The copper alloy uses a large amount of inexpensive iron element in the composition design; due to the immiscibility of copper and iron in the molten state, the starting alloy is mainly copper in the smelting process, a small amount of iron is added for melting, and after melting, Cu-Fe master alloy is added in a master alloy manner, alloy elements yttrium and magnesium are jointly addedin the smelting, which acts as a modificator and promotes the uniform distribution of the iron phase in the copper matrix in the solidified state, so that the alloy product finally has uniform properties, electromagnetic wave shielding performance and high strength and high thermal conductivity. The copper alloy material is suitable for non-vacuum large-scale industrial manufacturing.

The invention relates to a high strength, high conductivity graphene/copper nanocomposite material and a preparation method and application thereof. A copper matrix of the composite material is uniformly distributed in three-dimensional nanometer scale, the scale is between 10-100 nm, preferably, 30nm-80nm; and graghene is of a three-dimensional interconnection network structure in the composite material, and the number of average layers is 1-100. The obtained graphene/copper nanocomposite material has the characteristics of high strength, high modulus and high conductivity, and can be used asvarious types of conductive materials.

The invention discloses a continuous casting thermal compound device which comprises a bracket, a steel plate conveying device fixedly connected with the bracket, a sealing and heating device, an alloy metal thermal-insulation device, an alloy layer rolling and leveling device, a cooling device, a rolling roll device and an alloy melting device; an outlet at the bottom of the alloy metal thermal-insulation device is communicated with a chute runner at the top of a steel plate conveyer belt; an ultrasonic device is arranged below the chute runner; the cooling device is composed of multi-row orientated nozzles; all parts are regulated by a control system. The continuous casting thermal compound device is utilized for continuous casting and thermal compound of the copper lead alloy and the steel to produce a bimetallic bearing material; the copper lead-steel bearing material produced by the device of the invention has slender alloy structure, where the lead shows a short-shoot shape and a small part thereof has a shape of ball and is distributed uniformly on the copper matrix, without net-like structure or discontinuous net-like structure; the bearing material also has good homogeneity of structure, with relatively high bonding strength between duplex metals and stable and reliable quality.

The invention discloses a method for preparing a graphene reinforced copper base composite material. Uniformly mixed graphene and copper powder are covered by a thin pure copper chip; the pouring speed is not higher than 1 mm/s; the influence on the graphene dispersing process by flowing of molten copper in the pouring process is controlled; and the temperature of the poured molten copper is not lower than 1080 DEG C and not higher than 1200 DEG C. The method can prominently improve distribution of graphene in a copper matrix in the process of using a casting method to prepare the graphene reinforced copper base composite material, and enhances the material strength and hardness; the average hardness of the graphene reinforced copper base composite material in the method can reach above 80 HV; the electric conductivity under normal temperature is not lower than 80% IACS; and the heat conducting coefficient under normal temperature is not lower than 339 w/(mK).

The invention discloses a copper-based mosaic structure interface diamond coating and a preparation method and application thereof. The coating consists of a copper-diamond composite coarse sanding plating layer, a copper reinforcing layer, a copper-diamond composite thin sanding layer and a CVD diamond epitaxial growth layer from the bottom to the top. The preparation method comprises the following steps of: 1, depositing the copper-diamond composite coarse sanding plating layer, the copper reinforcing layer and the copper-diamond composite thin sanding layer on a copper matrix in turn to obtain a workpiece deposited with the copper-diamond composite plating layer; and 2, performing homogeneous epitaxial growth on the diamond exposed on the surface of the workpiece deposited with the copper-diamond composite plating layer in a CVD diamond deposition system to obtain the continuous diamond coating. The copper-based mosaic structure interface diamond coating has the advantages of high purity, few impurities, low thermal stress and firm combination with the matrix, and is an ideal choice of a microelectronic heat sink material.

The invention provides an intelligent nanometer container capable of preventing corrosion of copper and copper alloy, and preparation and application methods thereof, belonging to the technical field of corrosion prevention. Mesoporous silica microspheres with controllable particle size can be obtained by adjusting preparation conditions; by supporting a corrosion inhibitor reacting with a copper matrix, a protective film can be formed on the surfaces of copper and copper alloy thereof, so as to effectively inhibit the corrosion of the copper and copper alloy thereof; the surface of the mesoporous silica microspheres supported with large-capacity high-efficiency corrosion inhibitor is modified, and after the modified mesoporous silica microspheres are applied to an intelligent self-restoration anti-corrosion coating, not only can the compatibility of the mesoporous silica microspheres with the coating resin be further improved, but also the purpose of automatically controlling release rate of the corrosion inhibitor can be realized, and the purpose of remarkably improving the prevention effect of the common organic anti-corrosion coating and prolonging the prevention service life can be achieved. Especially when the coating is damaged, the coating has self-restoration function, and the prevention service life of the coating can be prolonged.

The invention relates to the field of preparation of two-dimensional transition-group metal carbide new materials and preparation thereof by chemical vapor deposition (CVD), particularly a high-quality ultrathin two-dimensional transition-group metal carbide crystal and a preparation method thereof. The preparation method is suitable for preparing large-area high-quality ultrathin two-dimensional transition-group metal carbides. The preparation method comprises the following steps: by using a copper foil (top layer)/transition group metal foil (bottom layer) bimetal lamination as a growth matrix, carrying out catalytic cracking on a carbon source at high temperature by a CVD technique to grow the ultrathin two-dimensional transition metal carbide crystal, and etching to remove the copper matrix, thereby obtaining the ultrathin two-dimensional transition group metal carbide crystal. The high-quality ultrathin two-dimensional transition-group metal carbide crystal has the characteristics of simple preparation technique, controllable product thickness and size and the like, and is suitable for large-area preparation, thereby laying a foundation for the research and application of the high-quality ultrathin two-dimensional transition-group metal carbide crystal in the fields of catalysis, energy storage, wear-resistant coatings, transparent conducting films, heat management and two-dimensional superconduction.