High heat conductivity copper-base composite material and preparation method thereof

Abstract

The invention belongs to the technical field of preparation of electronic packaging materials, and particularly designs a copper-based composite material with high thermal conductivity and a preparation method thereof. The copper-based composite material is made of a reinforcement and a binder through a prefabricated injection molding process to make a reinforcement prefabricated part, wherein the size of the reinforcement particle is 7-60 μm, and it is composed of silicon carbide particles, diamond particles or aluminum nitride particles. One or two of them; the copper matrix is ​​directly placed on the reinforcement preform, wherein the copper matrix is ​​electrolytic copper or oxygen-free copper, and the volume ratio of the reinforcement to the copper matrix is ​​50-75%: 25-50 %, made by pressure infiltration process. The preparation method adopts the injection molding process of the prefabricated part and the pressure impregnation process to prepare the high thermal conductivity copper matrix composite material. The thermal conductivity of the copper-based composite material in the present invention is higher than that of the aluminum-based composite material with the same reinforcement system, the material itself has low density and small thermal expansion coefficient, which meets the requirement of light weight of the packaging material.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging materials, and particularly designs a copper-based composite material with high thermal conductivity and a preparation method thereof. Background technique [0002] Electronic packaging tends to be miniaturized, which leads to a rapid increase in chip integration, resulting in increased heat generation and continuous rise in circuit operating temperature. The thermal conductivity of pure copper is 401W / m K, and the thermal expansion coefficient is as high as 16.5×10 -6 / K, so in order to take advantage of the high thermal conductivity of copper and avoid the thermal stress caused by the excessive thermal expansion coefficient during application, one method is to add W, Mo and low expansion alloy ( Such as FeNi alloy) and other powders are W / Cu, Mo / Cu and Invar / Cu materials commonly used in the field of electronic packaging materials. This type of copper-based composite material has ...

AI Technical Summary

Problems solved by technology

The main problem in the application of this type of copper-based composite material is that it is difficult to process, and it is difficult to prepare thin-walled and complex-structured devices. The existing preparation methods mainly include powder metallurgy or direct infiltration of metal in reinforcement particles. These preparation methods all inevitably face the above problems

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