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Thermosetting resin composition with high heat conductivity, prepreg manufactured by adopting same and copper-clad laminate

A technology of copper-clad laminates and resin compositions, applied in coatings, circuit substrate materials, paper coatings, etc., can solve problems such as low heat resistance, low thermal decomposition temperature, and large thermal expansion coefficient, and achieve cost Low, simple manufacturing process, good thermal conductivity effect

Inactive Publication Date: 2010-06-16
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, while the above-mentioned patents improve the thermal conductivity, their heat resistance is not very high (the glass transition temperature is less than 150 ° C, the thermal expansion coefficient is large, and the thermal decomposition temperature is low).

Method used

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  • Thermosetting resin composition with high heat conductivity, prepreg manufactured by adopting same and copper-clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Step 1: PI resin synthesis

[0038] Add 100 g of diallyl bisphenol A (DABPA) and 250 g of diphenylmethane bismaleimide (BDM) into a three-necked flask, raise the temperature to 130°C for 2 hours, and then naturally cool to room temperature to obtain viscous liquid PI resin.

[0039] Step 2:

[0040] Add 150 g of the PI resin synthesized above into a 1 L flask with a stirring paddle, then add 20 g of DMF (N, N-dimethylformamide), and stir for about half an hour. Then add 200g of boron nitride and 130g of DMF into another 1L dry clean flask, and stir the filler for half an hour until the filler is in a homogeneous state in the solvent. Then pour the mixed resin into the filler, stir for one hour, and add 0.05 g of catalyst. Use a ball mill to grind for 24 hours to get the glue used for gluing. Use 1080 cloth for gluing, and bake at 155°C for about 3 minutes to obtain a semi-cured adhesive sheet. Stack 10 adhesive sheets together, cover both sides with copper foil, an...

Embodiment 2

[0042] Add 100 g of PI resin synthesized in Step 1 of Example 1 above into a 1 L flask with a stirring paddle, then add 20 g of DMF (N, N-dimethylformamide), and stir for about half an hour. Then add 323.5g of alumina and 130g of DMF into another 1L dry clean flask, and stir the filler for half an hour until the filler is in a homogeneous state in the solvent. Then pour the mixed resin into the filler, stir for one hour, and add 0.05 g of catalyst. Use a ball mill to grind for 24 hours to get the glue used for gluing. Use 1080 cloth for gluing, and bake at 155°C for about 3 minutes to obtain a semi-cured adhesive sheet. Stack 10 adhesive sheets together, cover both sides with copper foil, and laminate in a vacuum press at 200°C for 150 minutes to obtain a high Tg and high thermal conductivity copper clad laminate. The properties of the board are shown in Table 1.

Embodiment 3

[0044] Step 1: PI resin synthesis

[0045] Add 100g of diallyl bisphenol A (DABPA) and 400g of diphenylmethane bismaleimide (BDM) into a three-necked flask, raise the temperature to 135°C for a constant temperature reaction for 2 hours, and then naturally cool to room temperature to obtain a viscous liquid resin .

[0046] Step 2:

[0047] Add 100g of the PI resin synthesized above in a 1L flask with a stirring paddle, 32g of high bromine epoxy resin A (epoxy equivalent 400g / mol, solid content 61%), 14g isocyanate modified epoxy resin B (solid content 76%) , epoxy equivalent 360g / mol), then add 20g DMF (N, N-dimethylformamide), stir for about half an hour. Then add 303g of alumina and 80g of DMF into another 1L dry clean flask, and stir the filler for half an hour until the filler is in a homogeneous state in the solvent. Pour the mixed resin into the filler and stir for one hour, and add 0.05 g of catalyst. Use a ball mill to grind for 24 hours to get the glue used for gl...

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Abstract

The invention relates to a thermosetting resin composition with high heat conductivity, a prepreg manufactured by adopting the same and a copper-clad laminate. The thermosetting resin composition with high heat conductivity comprises the following components in parts by mass: 5 parts of allyl phenolic compound, 5-40 parts of bismaleimide compound, 0-30 parts of modified resin, 25-85 parts of filler and 1-8 parts of catalyst. The thermosetting resin composition with high heat conductivity, which is provided by the invention, has the superior properties of high heat conductivity, high glass transition temperature, low CTE, high heat decomposition temperature, favorable process deformability and the like; the prepreg is simple to manufacture and has better heat resisting effect and high heat conductivity; and the copper-clad laminate can be applied to the manufacture of a high multi-layer circuit with high-temperature resistance and has simple manufacture process and lower cost.

Description

technical field [0001] The invention relates to a thermosetting resin composition, in particular to a thermosetting resin composition with high thermal conductivity and high heat resistance used in the field of copper-clad laminates, and a prepreg and a copper-clad laminate made thereof. Background technique [0002] With the mass production of electronic information products and the design trend towards light, thin, small and multi-functional, the printed circuit substrate (PCB), which is the main supporting substrate of electronic components, is also continuously improving its technical level to provide high-density wiring, High multilayer, thin profile, fine pore size, high dimensional stability, high heat dissipation and low price, especially the new high-density semiconductor structure multilayer (Build-Up) process technology and high heat dissipation multilayer (Build-Up) organic materials The development of semiconductor packaging is a very important link in current s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L63/00C08L79/04C08L71/12C08L9/02C08L51/08C08L51/04C09J179/08D06M15/37D06M15/55D06M15/693D06M15/53D21H19/24D21H19/22H05K1/03
Inventor 苏民社孔凡旺高冠群
Owner GUANGDONG SHENGYI SCI TECH
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