31 results about "Invar" patented technology

A kind of preparation method of Cu / Ag (Invar) composite material for electronic packaging, adopt main salt to be AgNO3, reductant is the chemical plating solution system of KNaC4H4O6 carry out chemical plating Ag to the Invar powder body that average particle diameter is 25-50 um, The electroless plating Ag(Invar) composite powder is prepared. The Ag(Invar) composite powder and Cu powder with an average particle size of 25-50 um are used as raw materials. After the ingredients are distributed according to 30-50 wt% Cu, the raw material powder is added Zinc stearate with a total volume of 0.5wt% is used as a lubricant, biaxial roller mixing, unidirectional pressing at 300-600 MPa, high-purity H2 atmosphere protection, sintering at 650-800°C for 1-3 h under normal pressure to prepare Cu / Ag(Invar) composite material, and adopts multi-pass cold rolling + annealing deformation heat treatment process to achieve near complete densification of the composite material. The 40 wt% Cu / Ag(Invar) composite prepared by the above process can achieve a density of 99%, a hardness of HV256, a thermal expansion coefficient of 11.2×10‑6 K‑1, and a thermal conductivity of 53.7 W·(m·K)‑ 1. It has excellent comprehensive performance and can be used as a heat sink material for high-performance electronic packaging.

A reflective metrological scale has a scale pattern of elongated side-by-side marks surrounded by reflective surface areas of a substrate, which may be a nickel-based metal alloy such as Invar <*> or Inconel <*> and may be a thin and elongated flexible tape. Each mark has a furrowed cross section and may have a depth in the range of 0.5 to 2 microns. The central region of each mark may be rippled or ridged and may be darkened to provide an enhanced optical reflection ratio with respect to surrounding reflective surface areas. A manufacturing method includes the repeated steps of (1) creating a scale mark by irradiating a surface of the substrate at a mark location with a series of overlapped pulses from a laser, each pulse having an energy density of less than about 1 joule per cm<2>, and (2) changing the relative position of the laser and the substrate by a displacement amount defining a next mark location on the substrate at which a next mark of the scale is to be created.