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A kind of preparation method of cu/ag (invar) composite material for electronic packaging

A composite material, electronic packaging technology, applied in metal material coating process, transportation and packaging, metal processing equipment, etc., to achieve the effect of improving mechanical and thermal physical properties, reducing thermal expansion coefficient, and excellent comprehensive performance

Inactive Publication Date: 2018-09-14
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The material design and preparation method of the above-mentioned Cu / Ag(Invar) alloy composite material are all original creations of the patent of the present invention, and have not been published at home and abroad.

Method used

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  • A kind of preparation method of cu/ag (invar) composite material for electronic packaging
  • A kind of preparation method of cu/ag (invar) composite material for electronic packaging
  • A kind of preparation method of cu/ag (invar) composite material for electronic packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Example 1: 40 wt% Cu / Ag(Invar) composite sintered at atmospheric pressure at 750°C

[0034] (1) Electroless silver plating on the surface of Invar alloy powder: the main salt in the electroless silver plating solution is AgNO 3 , the reducing agent is potassium sodium tartrate (KNaC 4 h 4 o 6 ), ammoniacal liquor is as complexing agent, and the step of chemical plating Ag is:

[0035] (1) Weigh 33.5 g of AgNO 3 , dissolved in 500 mL deionized water to prepare 67 g / L colorless, clear and transparent AgNO 3 solution;

[0036] (2) Add complexing agent ammonia water dropwise to the above solution, and the reaction begins to produce dark brown Ag 2 O precipitation, continue to drop complexing agent ammoniacal liquor, precipitation disappears gradually, till forming colorless transparent solution;

[0037] (3) In the colorless transparent solution described in step (2), add dropwise the NaOH aqueous solution of 10 g / L, regulate the pH value of solution to 11.5, obtain ...

Embodiment 2

[0045] Example 2: 40 wt% Cu / Ag(Invar) composite sintered at atmospheric pressure at 775°C

[0046] The preparation process of this example is the same as Example 1, the difference is that the normal pressure sintering temperature in step (5) is 775 °C, other processes and parameters remain unchanged, 40 wt% Cu / Ag(Invar ) Microstructure (a) and fracture morphology (b) of the composite material as image 3 shown.

[0047] Such as figure 1 As shown, the Ag layer on the surface of the Ag(Invar) composite powder particles prepared by electroless plating in a silver ammonia solution with a pH of 11.5 for 30 min is uniform and continuous, has a compact structure, and is tightly combined with the Invar alloy substrate, with a thickness of 2-3 μm . Such as figure 2 , as shown in 3, the Ag(Invar) in the 40 wt% Cu / Ag(Invar) alloy composite sintered at atmospheric pressure is uniformly distributed in the Cu alloy matrix in a network shape, without agglomeration, and most of the pores...

Embodiment 3

[0048] Example 3: Deformation heat treatment of 40 wt% Cu / Ag(Invar) composite sintered at atmospheric pressure at 775°C

[0049] For the 775 °C normal pressure sintered 40 wt% Cu / Ag(Invar) composite material prepared in Example 2, the deformation heat treatment was carried out: the sintered Cu / Ag(Invar) composite material sample was subjected to multiple passes by using a twin-roll cold rolling process The first rolling, the rolling force is 500 kN, and the deformation in each pass is less than 5%. When the thickness of the sample is reduced to 40%, the intermediate annealing is carried out at 600 °C and kept for 1h, and the final annealing is carried out when the thickness of the sample is reduced to 55%. The annealing temperature was 400 °C, and the temperature was kept at 2 h. The heating rate of Cu / Ag(Invar) alloy composite was set at 5 °C / min. After the heat preservation was completed, the composite material was cooled to room temperature with the furnace. Both the interm...

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Abstract

A kind of preparation method of Cu / Ag (Invar) composite material for electronic packaging, adopt main salt to be AgNO3, reductant is the chemical plating solution system of KNaC4H4O6 carry out chemical plating Ag to the Invar powder body that average particle diameter is 25-50 um, The electroless plating Ag(Invar) composite powder is prepared. The Ag(Invar) composite powder and Cu powder with an average particle size of 25-50 um are used as raw materials. After the ingredients are distributed according to 30-50 wt% Cu, the raw material powder is added Zinc stearate with a total volume of 0.5wt% is used as a lubricant, biaxial roller mixing, unidirectional pressing at 300-600 MPa, high-purity H2 atmosphere protection, sintering at 650-800°C for 1-3 h under normal pressure to prepare Cu / Ag(Invar) composite material, and adopts multi-pass cold rolling + annealing deformation heat treatment process to achieve near complete densification of the composite material. The 40 wt% Cu / Ag(Invar) composite prepared by the above process can achieve a density of 99%, a hardness of HV256, a thermal expansion coefficient of 11.2×10‑6 K‑1, and a thermal conductivity of 53.7 W·(m·K)‑ 1. It has excellent comprehensive performance and can be used as a heat sink material for high-performance electronic packaging.

Description

technical field [0001] The invention relates to a method for preparing a metal matrix composite material, in particular to a method for preparing a Cu / Ag (Invar) composite material, and belongs to the field of new materials and its preparation technology. Background technique [0002] Cu / Invar alloy composite material combines the high electrical conductivity and thermal conductivity of Cu and the zero expansion characteristics of Invar alloy. Performance demands of high heat dissipation, low coefficient of thermal expansion mismatch with semiconductor and ceramic substrates, and high reliability. However, the development and utilization of this metal matrix composite needs to be solved: 1) During the sintering preparation process, atomic diffusion at the Cu / Invar interface is prone to occur, which leads to changes in the composition of Cu and Invar alloy in the composite material, which leads to the poor electrical and thermal conductivity of Cu and the poor performance of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/04C22C9/00C22C30/02B22F1/02C23C18/44
CPCC22C1/04C22C1/0425C22C9/00C22C30/02C23C18/44B22F1/17
Inventor 汤文明张昕吴玉程
Owner HEFEI UNIV OF TECH
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