A method for preparing tungsten-copper or molybdenum-copper high-voltage contact materials by direct forming
A high-voltage contact, direct technology, applied in the direction of pressure inorganic powder plating, electrical components, electrical switches, etc., can solve the problems of tungsten or molybdenum particle aggregation and growth, copper solidified phase distribution coarse, coarse and uneven, etc., to reduce Equipment cost, overcoming high temperature deformation, and reducing the effect of thermal stress
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Embodiment 1
[0020] A method for directly forming a tungsten-copper high-voltage contact material, comprising the following steps:
[0021] The first step is to uniformly mix the raw material powder according to the composition ratio of the high-voltage contact. The composition includes 50-80% copper by mass percentage, 20-50% tungsten, the particle size of tungsten is 5-50μm, and the particle size of copper is 70 -150μm,
[0022] In the second step, the mixed raw material powder is input into the powder feeding system of the cold spraying system, and the heated gas is used for spraying. The temperature of the heated gas is 500-550°C. The collision copper substrate undergoes plastic deformation, and then deposits on the surface of the copper base to form a high-voltage contact material. The gas is air.
[0023] The cold spraying system includes a high-pressure gas source, a gas heater, a high-pressure powder feeder, a gas regulation control system and a spray gun, the high-pressure gas so...
Embodiment 2
[0026] A method for directly forming a tungsten-copper high-voltage contact material, comprising the following steps:
[0027] The first step is to uniformly mix the raw material powder according to the composition ratio of the high-voltage contact. The composition includes 20-60% copper by mass percentage, 40-80% tungsten, the particle size of tungsten is 5-50μm, and the particle size of copper is 70 -150μm,
[0028] In the second step, the mixed raw material powder is input into the powder feeding system of the cold spraying system, and the heated gas is used for spraying. The temperature of the heated gas is 500-550°C. The collision copper substrate undergoes plastic deformation, and then deposits on the surface of the copper base to form a high-voltage contact material. The gas is industrial nitrogen.
[0029] The cold spraying system includes a high-pressure gas source, a gas heater, a high-pressure powder feeder, a gas regulation control system and a spray gun, the high...
Embodiment 3
[0032] A method for directly forming a tungsten-copper high-voltage contact material, comprising the following steps:
[0033] The first step is to uniformly mix the raw material powder according to the composition ratio of the high-voltage contact. The composition includes 20-60% copper by mass percentage, 40-80% tungsten, the particle size of tungsten is 5-50μm, and the particle size of copper is 70 -150μm,
[0034] In the second step, the mixed raw material powder is input into the powder feeding system of the cold spraying system, and the heated gas is used for spraying. The temperature of the heated gas is 500-550°C. The collision copper substrate undergoes plastic deformation, and then deposits on the surface of the copper base to form a high-voltage contact material. The gas is industrial pure argon.
[0035] The cold spraying system includes a high-pressure gas source, a gas heater, a high-pressure powder feeder, a gas regulation control system and a spray gun, the hi...
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