The invention relates to a method for molding a via hole of a
printed circuit board, which comprises the steps of: film attachment, in which the surfaces of upper and lower surface
copper layers of an insulating
dielectric layer drilled with the via hole are attached with photosensitive films, and the positions, which correspond to the via hole, on the photosensitive films are provided with film openings; hole-sealing
electroplating, in which an orifice end, which is near a first surface, of the via hole is closed through a
copper electroplating process on the first surface of the insulating
dielectric layer; hole-filling
electroplating, in which the via hole is completely filled with
copper, and the filled copper is connected with the surface copper layer of a second surface of the insulating
dielectric layer, namely the connection of
solid via holes between upper and lower adjacent line layer patterns is realized; and the post-treatment, in which the two surfaces of the insulating
dielectric layer are subjected to subsequent treatment respectively, and a level conducting surface which is convenient for implementing subsequent pattern line production working procedures is obtained by removing the photosensitive films, removing the filled copper higher than the surface copper
layers, and leveling the board surface. The method has the advantages of simple, convenient and feasible process, low cost, and small area occupation, and upper and lower corresponding line rackets of the hole are integrally preserved, are not damaged by the via hole and have good electrical properties.