The invention relates to the technical field of PCBs, and discloses a manufacturing method for a stepped groove with non-metallized side walls and a PCB. The manufacturing method comprises the following steps of pressing and preparing a multilayer board with an initial stepped groove, wherein the multilayer board comprises a first outer-layer surface and a second outer-layer surface, and a notch of the initial stepped groove is arranged in the first outer-layer surface; carrying out overall
copper plating on the multilayer board and then carrying out overall
tin plating; removing a
tin layer on the surface of a first junction position and a second junction position in order to
expose a
copper layer on the first junction position and the second junction position, wherein the first junctionposition is located at the junction position of the side wall and the first outer-layer surface, and the second junction position is located at the junction position of the side wall and a bottom surface; removing the
copper layer at the two junction positions, and then removing the residual
tin layer; and manufacturing a preset graph at the groove bottom of the initial stepped groove, and removing the copper layer at the side walls. According to the manufacturing method and the PCB, the stepped groove is manufactured firstly and then the graph of the groove bottom is manufactured; compared with the prior art, the manufacturing process can be greatly simplified, the operation difficulty is reduced, and the working efficiency is improved.