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Method for no-glass-cloth ceramic high-frequency PCB plate edge metallization

A PCB board and glass cloth technology, applied in the direction of circuit devices, processing steps, printed circuit components, etc., can solve the problems of board edge metallization, difficult operation, easy to break the board, etc., to solve the problem of electrostatic discharge protection, solve The effect of the broken plate problem

Active Publication Date: 2015-10-28
SHENZHEN KINWONG ELECTRONICS
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Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a method for metallizing the edge of a glass-cloth ceramic high-frequency PCB board, aiming at improving the basis of the maximum imposition utilization rate of a glass-cloth ceramic high-frequency material PCB board On the one hand, it solves the problems of difficult operation, easy board breakage and metallization of the board edge during the production process

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  • Method for no-glass-cloth ceramic high-frequency PCB plate edge metallization

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Embodiment Construction

[0021] The present invention provides a method for metallizing the edge of a glass-cloth ceramic high-frequency PCB board. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0022] The present invention is a method for metallizing the edges of high-frequency PCB boards without glass cloth, and the specific implementation steps are as follows:

[0023] A. Drilling: Cut the selected ceramic high-frequency PCB board into the required size, bake it, and drill through holes on the surface of the PCB board with a drill;

[0024] B. Groove: Prepare the gong belt and gong knife, import the gong belt data on the CNC gong machine, drill the through groove around the PCB board, and reserve a connection position at the...

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Abstract

The invention discloses a method for no-glass-cloth ceramic high-frequency PCB plate edge metallization. The method comprises steps: board cutting, drilling, groove milling, plasma processing, copper deposition, board plating, patterning, pattern electroplating, etching, solder resisting, gold deposition, board milling and the like. Through the method, plate edge metallization can be achieved, the problem of electrostatic discharge protection is solved effectively, and the breaking problem of a ceramic high-frequency PCB during the manufacturing process can be solved effectively.

Description

technical field [0001] The invention relates to the field of PCB production, in particular to a method for metallizing the edge of a glass-cloth-free ceramic high-frequency PCB board. Background technique [0002] The common PCB design is to insulate the edge of the board, and metal substances are not allowed to attach. In the antenna application using high-frequency materials, in order to prevent electromagnetic wave interference, the edge of the PCB board is designed to be metallized. The PCB board used in this design is a ceramic high-frequency board without glass cloth. The following problems exist in the existing general engineering design and production methods: the material is soft, there is no glass cloth, the board is easy to break, and the operation is extremely difficult to control; and the general engineering design is to form the edge of the finished product, and the edge of the board is insulated substrate, without metallization. [0003] Therefore, the prior...

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Application Information

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IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0213H05K3/00H05K2203/14
Inventor 王俊张霞曾平李文冠
Owner SHENZHEN KINWONG ELECTRONICS
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