Soft and hard combined semi-finished product board, manufacturing method thereof and soft and hard combined board manufacturing method

Abstract

The invention discloses a soft and hard combined semi-finished product board, a manufacturing method thereof and a soft and hard combined board manufacturing method. The soft and hard combined semi-finished product board comprises a soft board layer, wherein an upper cover film layer, an upper first film layer, an upper hard board layer, an upper second film layer and an upper copper foil layer are laminated on one surface of the soft board layer from bottom to top, and a lower cover film layer, a lower first film layer, a lower hard board layer, a lower second film layer and a lower copper foil layer are laminated on the other surface of the soft board layer from top to bottom; a first window is formed in the upper first film layer; a second window is formed in the lower first film layer; a third window is formed in the upper hard board layer; a fourth window is formed in the upper second film layer; a fifth window is formed in the lower hard board layer; a sixth window is formed in the lower second film layer; an upper etching-resistant printing ink layer is printed on the upper surface of the bending area of the soft board layer, and a lower etching-resistant printing ink layer is printed on the lower surface of the bending area of the soft board layer. An uncovering technology does not need to be carried out, the production efficiency is high, the product quality is good, and volume production is facilitated.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a rigid-flex semi-finished board and a manufacturing method thereof, and a rigid-flex board manufacturing method. Background technique [0002] Such as figure 1 Shown is the soft-rigid combination semi-finished board obtained after the lamination process in the prior art, which includes a soft board layer, and one side of the soft board layer is provided with an upper covering film layer, an upper first film layer, an upper hard board layer from bottom to top. Board layer 4, upper second film layer 5 and upper copper foil layer 6, the other side of the soft board layer is provided with a lower cover film layer 7, a lower first film layer 8, a lower hard board layer 9, a lower second Two film layers 10 and a lower copper foil layer 11, wherein the upper first film layer is provided with a first window 31 corresponding to the bending area of ​​the soft b...

AI Technical Summary

Problems solved by technology

[0017] In the existing production process of rigid-flex boards, it is necessary to manually fill epoxy resin blocks at the window openings, which is very inefficient, and the filling material is easy to slide and shift, resulting in defective products after lamination; when performing the uncovering process, A single drill bit of each milling machine can only process one board at a time, the processing speed is very slow, it cannot be mass-produced, and the production efficiency and product quality are difficult to guarantee

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