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Manufacturing method for stepped groove with non-metallic side walls and PCB

A production method and non-metallization technology, which is applied to printed circuits connected with non-printed electrical components, multi-layer circuit manufacturing, printed circuit manufacturing, etc., can solve the problems of complex manufacturing process, poor versatility, and difficult operation, and achieve Simplify the production process, improve work efficiency, and reduce the difficulty of operation

Active Publication Date: 2018-08-14
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a method for manufacturing a non-metallized side wall stepped groove and PCB, which overcomes the defects of complex manufacturing process, difficult operation and poor versatility in the prior art

Method used

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  • Manufacturing method for stepped groove with non-metallic side walls and PCB
  • Manufacturing method for stepped groove with non-metallic side walls and PCB
  • Manufacturing method for stepped groove with non-metallic side walls and PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] see figure 1 , the first embodiment provides a method for fabricating a stepped groove with a non-metallized sidewall, including the steps:

[0060] Step 101. After the inner layer pattern is completed, a multi-layer board with an initial stepped groove is formed by pressing, such as figure 2 shown.

[0061] Wherein, the multi-layer board includes a first outer layer surface and a second outer layer surface distributed along the stacking direction, and the bottom surface and sidewall of the initial stepped groove are not metallized; the initial stepped groove can be filled or embedded with gaskets. To make the molding, the notch of the initial stepped groove is formed on the surface of the first outer layer.

[0062] The method of making the initial stepped groove by using the embedded gasket method is as follows: complete the inner layer graphics of each core board respectively; open windows at the preset positions on the specified inner core board and the specified...

Embodiment 2

[0082] The second embodiment provides another method for fabricating a stepped groove with a non-metallized sidewall. The groove bottom of the stepped groove is not only formed with a predetermined pattern but also has a via hole.

[0083] see Figure 12 As shown, the manufacturing method of the stepped groove in this embodiment includes the steps:

[0084] Step 201 , forming an initial stepped groove, and neither the bottom surface nor the side wall of the initial stepped groove is metallized.

[0085] Step 202: Open via holes inside and outside the initial stepped groove, and perform overall copper immersion plating on the multilayer board, so that the outer surface of the multilayer board (including the first outer layer surface and the second outer layer surface distributed along the stacking direction), the initial The inner surface of the stepped groove (including the sidewall and bottom surface of the initial stepped groove) and the inner wall of the via hole are plate...

Embodiment 3

[0099] The third embodiment provides a PCB, which includes a stepped groove with a non-metallized sidewall, and the stepped groove is manufactured according to the manufacturing method provided in the first embodiment or the second embodiment.

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Abstract

The invention relates to the technical field of PCBs, and discloses a manufacturing method for a stepped groove with non-metallized side walls and a PCB. The manufacturing method comprises the following steps of pressing and preparing a multilayer board with an initial stepped groove, wherein the multilayer board comprises a first outer-layer surface and a second outer-layer surface, and a notch of the initial stepped groove is arranged in the first outer-layer surface; carrying out overall copper plating on the multilayer board and then carrying out overall tin plating; removing a tin layer on the surface of a first junction position and a second junction position in order to expose a copper layer on the first junction position and the second junction position, wherein the first junctionposition is located at the junction position of the side wall and the first outer-layer surface, and the second junction position is located at the junction position of the side wall and a bottom surface; removing the copper layer at the two junction positions, and then removing the residual tin layer; and manufacturing a preset graph at the groove bottom of the initial stepped groove, and removing the copper layer at the side walls. According to the manufacturing method and the PCB, the stepped groove is manufactured firstly and then the graph of the groove bottom is manufactured; compared with the prior art, the manufacturing process can be greatly simplified, the operation difficulty is reduced, and the working efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), and in particular, to a method for manufacturing a stepped groove with non-metallized sidewalls and a PCB. Background technique [0002] With the advancement of science and technology, electronic products have become an indispensable daily necessities in people's lives, and PCB is an important part of electronic products. In recent years, people have more and more functional requirements for electronic products. higher requirement. Usually, in order to facilitate the installation of devices with special functions or devices that need to be sunk on the PCB, it is often necessary to set a stepped groove on the PCB. The stepped groove is also an important part of realizing high-power heat dissipation of the product and is widely used in the industry. [0003] The side wall of the stepped groove can be metallized or non-metallized; for the PCB with the non-...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K1/18
CPCH05K1/183H05K3/4697H05K2203/14
Inventor 焦其正纪成光王洪府王小平
Owner DONGGUAN SHENGYI ELECTRONICS
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