Method for manufacturing thin single-sided flexible circuit board

Abstract

The invention discloses a method for manufacturing a thin single-sided flexible circuit board. The method comprises the following steps: A, preparing a single-sided copper foil substrate; B, drilling a positioning hole; C, pasting a dry film; D, performing local exposure; E, performing developing; F, etching thin copper; G, performing demolding; H, performing dry film pretreatment; J, pasting a dry film; K, performing circuit exposure; and L, performing DES. The single-face copper foil substrate is adopted, the thickness of the base material layer of the single-face copper foil substrate is the same as the thickness of the base material layer needed by a product, the thickness of the copper layer of the single-face copper foil substrate is larger than the thickness of the circuit layer of the product, and the product area is developed through the product area local exposure and development technology; and the copper layer in the product area is independently etched and thinned to the thickness of the circuit layer required by the product by adopting a copper etching and thinning process, so that the single-sided copper foil substrates with different required thicknesses are obtained, and the product area meets the product manufacturing requirement.

Description

technical field [0001] The invention relates to the technical field of manufacturing flexible circuit boards, in particular to a method for manufacturing thin single-sided flexible circuit boards. Background technique [0002] With the ultra-thin development of portable electronic products, the flexible circuit boards used are getting thinner and thinner. Thin flexible circuit boards are prone to wrinkle defects during the production process. In order to improve product wrinkle defects, such as figure 1 As shown, the existing thin single-sided flexible circuit board adopts a single-sided copper foil substrate that meets the product specifications, and prepares a carrier film on the substrate surface. After the circuit is made, the carrier film is peeled off. It has been improved, but because the expansion and contraction properties of the carrier film and the single-sided copper foil substrate are different, after the carrier film is peeled off, the substrate is curled and b...

AI Technical Summary

Problems solved by technology

[0002] With the ultra-thin development of portable electronic products, the flexible circuit boards used are getting thinner and thinner. Thin flexible circuit boards are prone to wrinkle defects during the production process. In order to improve product wrinkle defects, such as figure 1 As shown, the existing thin single-sided flexible circuit board adopts a single-sided copper foil substrate that meets the product specifications, and prepares a carrier film on the substrate surface. After the circuit is made, the carrier film is peeled off. It has been improved, but because the expansion and contraction properties of the carrier film and the single-sided copper foil substrate are different, after the carrier film is peeled off, the substrate is curled and bent, and the subsequent process is not easy to process, and after the carrier film is peeled off, the substrate is very thin. It is easy to wrinkle during the manufacturing process, resulting in a high rate of defective products. In the prior art, there is no method that can effectively improve product wrinkled defects. The present invention comes from this

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