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Manufacture method of multi-layer aluminum base sandwich printed circuit board

A manufacturing method and technology of printed boards, applied in the direction of printed circuit manufacturing, printed circuit, processing steps sequence, etc., can solve the problems of resin voids in holes, insufficient glue filling, easy corrosion of aluminum base, etc., and achieve lamination bonding force Good, easy to tear glue, good sealing effect

Active Publication Date: 2015-03-04
HUIZHOU KING BROTHER CIRCUIT TECH +2
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for manufacturing a multilayer aluminum-based sandwich printed board, so as to solve the problem of easy occurrence of delamination, resin voids in holes, The filling is not full and the aluminum base is easy to corrode, etc.

Method used

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  • Manufacture method of multi-layer aluminum base sandwich printed circuit board
  • Manufacture method of multi-layer aluminum base sandwich printed circuit board

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Embodiment Construction

[0038] The specific embodiment of the present invention is further described below in conjunction with accompanying drawing:

[0039] like figure 1As shown in the process flow chart of the manufacturing method of the multilayer aluminum-based sandwich printed board of the present invention, aluminum material is selected as the aluminum-based sandwich, and copper-clad foil is used as the upper and lower substrates, and the present invention is implemented according to the following steps:

[0040] First, prepare the upper and lower substrates, choose copper clad foil as the upper and lower substrates, and prepare the upper and lower substrates as conventional printed board substrates, mainly including substrate cutting, drilling positioning holes, drilling blind buried holes, copper plating, The steps of inner layer circuit making, blind hole electroplating, inner layer etching, inner layer melting, etc.

[0041] Secondly, the aluminum-based sandwich core is prepared, combined...

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Abstract

The invention discloses a manufacture method of a multi-layer aluminum base sandwich printed circuit board. The main manufacture process of the printed circuit board includes the steps: manufacturing an aluminum base sandwich isolating ring, performing vacuum lamination and glue filling for the aluminum base sandwich isolating ring, treating the surface of an aluminum base sandwich, and performing aluminum base sandwich edge sealing treatment and multi-layer laminated composite treatment. The isolating ring is manufactured at a metalized through hole in the aluminum base sandwich in a boring manner, the outer circle diameter of the isolating ring is larger than the diameter of the metalized through hole, aluminum base sandwich vacuum glue is pressed for the aluminum base sandwich isolating ring by taking a bored copper foil as surface protection, surface roughening and cleaning treatment are performed for the aluminum base sandwich after the vacuum glue is pressed, pressing and edge sealing treatment is performed for the aluminum base sandwich, and the aluminum base sandwich is fixedly clamped in the middle of the multi-layer PCB (printed circuit board) in an aligned manner and then is treated in a pressing manner to obtain the multi-layer aluminum base sandwich printed circuit board. By the aid of the manufactured printed circuit board, double surfaces of a metal base board can be attached, and the manufactured printed circuit board has the advantages of high production efficiency, product reliability and safety and fine radiating effect.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a multilayer aluminum-based sandwich printed board. Background technique [0002] With the development of light, thin, short, small, high-density and multi-functional electronic products, the assembly density and integration of components on printed boards are getting higher and higher, and the power consumption is increasing, which affects the heat dissipation of PCB substrates. The requirements are becoming more and more urgent. The heat dissipation of the substrate will directly affect the reliability and safety of the electronic equipment. Reduced reliability and security. [0003] In order to achieve good heat conduction and heat dissipation of circuit boards, the industry has gradually begun to use aluminum-based printed boards. Aluminum-based printed boards have excellent thermal conductivity and heat dissipation performance and m...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/4608H05K3/4611H05K2203/14
Inventor 唐宏华陈春林映生武守坤范思维石学兵刘敏
Owner HUIZHOU KING BROTHER CIRCUIT TECH
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