Fabrication method for high-aspect rate copper-thickness printed circuit board (pcb) solder mask

A technology with a high aspect ratio and a manufacturing method, which is applied in the directions of printed circuit manufacturing, printed circuit secondary processing, and sequence of processing steps, to achieve good market prospects and application value, and to improve the yield rate

Inactive Publication Date: 2015-11-25
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention is to overcome the PAD on the solder resist and the drop of the bridge in the PCB of the single-sided window plug hole design and the double-sided window plug hole design in the solder mask manufacturing process after development in the prior art. Or the problem of oil loss in the post-process, thus proposing a high aspect ratio copper thick pcb solder resist manufacturing method with good developing effect, no problems of bridge drop and oil loss, high quality, and low scrap rate

Method used

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Embodiment 1

[0019] This embodiment discloses a method for manufacturing a high-aspect-ratio copper-thick pcb solder resist. The method is as follows: the method is sequentially divided into three steps: a plug hole treatment step, a circuit oil spraying step, and a silk screen surface step.

[0020] (1) Carry out pre-treatment grinding plate for the first time to the whole board of circuit board, then carry out plug hole treatment step, then carry out pre-baking, development, inspection, back exposure, post-baking processing to plug hole order separately; Described back exposure step The energy value of the middle back exposure is 800 mJ / time; the pre-baking temperature in the plug hole processing step is 75° C., and the time is 45 minutes; the exposure ruler in the exposure step is 9-13 grids. The post-baking treatment is divided into eight sections, and the specific temperature and time of each section are: 55°C×60min, 65°C×60min, 75°C×60min, 85°C×60min, 95°C×60min, 110°C×60min, 130°C ℃...

Embodiment 2

[0024] This embodiment discloses a method for manufacturing a high-aspect-ratio copper-thick pcb solder resist. The method is as follows: the method is sequentially divided into three steps: a plug hole treatment step, a circuit oil spraying step, and a silk screen surface step.

[0025] (1) Carry out pre-treatment grinding plate for the first time to the whole board of circuit board, then carry out plug hole treatment step, then carry out pre-baking, development, inspection, back exposure, post-baking processing to plug hole order separately; Described back exposure step The energy value of the middle back exposure is 800 mJ / time, and the number of times is twice; the pre-baking temperature in the plugging treatment step is 75°C, and the time is 45 minutes; the exposure ruler in the exposure step is 9-13 grids. The post-baking treatment is divided into eight sections, and the specific temperature and time of each section are: 55°C×60min, 65°C×60min, 75°C×60min, 85°C×60min, 95°...

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Abstract

The invention belongs to the field of processing of a circuit board, in particular relates to a fabrication method for a high-aspect rate copper-thickness printed circuit board (pcb) solder mask. By respectively carrying out the three steps of plug hole processing, circuit oil spraying and screen printing and circuit boards are respectively processed after three steps, and thus, the technological difficulties that green oil in a plug hole is difficult to dry, humidity of the green oil is high, green oil is expanded fast with high temperature to cause oil explosion in the plug hole on PAD and the like are solved. First post-baking treatment is divided into eight sections, second post-baking treatment is divided into six sections, oil explosion during board baking with high temperature in one time is prevented, the fabrication yield of the high-aspect rate copper-thickness pcb solder mask is effectively improved, and the fabrication method has high favorable market prospect and application value.

Description

technical field [0001] The invention belongs to the field of circuit board processing, and in particular relates to a method for manufacturing high-aspect-ratio copper-thick PCB solder resist. Background technique [0002] In the prior art, in the process of circuit board processing, there are more and more high-aspect-ratio thick copper pcbs (thickness > 4mm, plug hole aspect ratio > 10, surface copper thickness > 2OZ). The production process of PCB original solder mask is as follows: pre-processing → plugging → silk screen surface oil → pre-baking → exposure → development → quality inspection → post-baking. During the production process, due to the thick copper on the surface and the thin silk screen printing oil for solder resist, the line is red and the aspect ratio is too large. [0003] In the actual production process, this method of the prior art has many limitations and disadvantages: because the thickness of the production plate is > 4mm, the aspect ra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/285H05K2203/13H05K2203/14
Inventor 王佐刘亚飞周文涛彭君
Owner SHENZHEN SUNTAK MULTILAYER PCB
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