Fabrication method for high-aspect rate copper-thickness printed circuit board (pcb) solder mask

Abstract

The invention belongs to the field of processing of a circuit board, in particular relates to a fabrication method for a high-aspect rate copper-thickness printed circuit board (pcb) solder mask. By respectively carrying out the three steps of plug hole processing, circuit oil spraying and screen printing and circuit boards are respectively processed after three steps, and thus, the technological difficulties that green oil in a plug hole is difficult to dry, humidity of the green oil is high, green oil is expanded fast with high temperature to cause oil explosion in the plug hole on PAD and the like are solved. First post-baking treatment is divided into eight sections, second post-baking treatment is divided into six sections, oil explosion during board baking with high temperature in one time is prevented, the fabrication yield of the high-aspect rate copper-thickness pcb solder mask is effectively improved, and the fabrication method has high favorable market prospect and application value.

Description

technical field [0001] The invention belongs to the field of circuit board processing, and in particular relates to a method for manufacturing high-aspect-ratio copper-thick PCB solder resist. Background technique [0002] In the prior art, in the process of circuit board processing, there are more and more high-aspect-ratio thick copper pcbs (thickness > 4mm, plug hole aspect ratio > 10, surface copper thickness > 2OZ). The production process of PCB original solder mask is as follows: pre-processing → plugging → silk screen surface oil → pre-baking → exposure → development → quality inspection → post-baking. During the production process, due to the thick copper on the surface and the thin silk screen printing oil for solder resist, the line is red and the aspect ratio is too large. [0003] In the actual production process, this method of the prior art has many limitations and disadvantages: because the thickness of the production plate is > 4mm, the aspect ra...

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Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention is to overcome the PAD on the solder resist and the drop of the bridge in the PCB of the single-sided window plug hole design and the double-sided window plug hole design in the solder mask manufacturing process after development in the prior art. Or the problem of oil loss in the post-process, thus proposing a high aspect ratio copper thick pcb solder resist manufacturing method with good developing effect, no problems of bridge drop and oil loss, high quality, and low scrap rate