Preparing method for silver plating graphene enhanced copper-based electric contact material
A technology of electrical contact materials and graphene, which is applied in the coating process of metal materials, contacts, circuits, etc., can solve the problems of reduced performance such as conductivity and density, high cost of magnetron sputtering, and poor interface bonding. Achieve the effects of improving bonding strength, good arc extinguishing performance, and improving arc ablation resistance
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Embodiment 1
[0020] (1) Take graphene with a single layer and go through roughening, sensitization and activation treatments in sequence, and finally add it to the chemical plating solution for silver plating. The roughening treatment solution is composed of concentrated sulfuric acid and concentrated nitric acid with a volume ratio of 3:1, and the sensitization solution is composed of 50ml / L HCl and 30g / L SnCl 2 Composition, the activation solution consists of 0.5g / L AgNO 3 and 30ml / L ammonia water, the plating solution consists of 20g / L AgNO 3 , 30g / L glucose, 100g / L potassium sodium tartrate and 40ml / L ethanol. All stages were ultrasonically dispersed for 40 minutes, washed with water and filtered until neutral, and finally dried in a vacuum oven for use;
[0021] (2) Take 200 mesh copper-yttrium alloy powder (0.1wt% yttrium content), and first remove the surface oxide layer with dilute sulfuric acid. Adopt the method of electroless silver plating to carry out electroless silver plat...
Embodiment 2
[0026] Carry out according to this composition ratio and the same preparation process steps and parameters of Example 1, wherein the graphene content is brought up to 0.2wt.%, and the AgNO of the graphene silver plating solution 3 Concentration increased to 25g / L. Through the above process, a copper-based electrical contact composite material is made.
[0027] Basic properties of this material: Density 90.0%; Electrical conductivity 81.2% IACS; Hardness 53.4HB; Oxidation weight gain of 1.6mg / cm2 under 400°C atmospheric conditions for 20h 2 .
Embodiment 3
[0029] According to the composition ratio and the same preparation process steps and parameters as in Example 2, copper-yttrium alloy powder with a yttrium content of 0.2wt.% was used. Through the above process, a copper-based electrical contact composite material is made.
[0030]Basic properties of this material: Density 88.6%; Electrical conductivity 76.3% IACS; Hardness 48.3HB; Oxidation weight gain of 2.0mg / cm2 under 400°C atmospheric conditions for 20h 2 .
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