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Rapid preparation method of copper-tungsten alloy

A copper-tungsten alloy, fast technology, applied in the field of rapid preparation of copper-tungsten alloy, can solve the problems of low heating rate and energy conversion efficiency, and achieve the effect of fast heating rate, prevention of alloy surface oxidation, and excellent alloy performance.

Inactive Publication Date: 2014-01-22
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned invention uses microwave-assisted heating of SiC sheets and conditions of atmosphere protection to realize the sintering preparation of alloys. Compared with traditional preparation methods, microwaves can quickly heat SiC sheets and transfer heat to alloy compacts, which is an excellent heat transfer method. Indirect heat conduction, heating rate and energy conversion efficiency are lower than direct microwave heating

Method used

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  • Rapid preparation method of copper-tungsten alloy
  • Rapid preparation method of copper-tungsten alloy
  • Rapid preparation method of copper-tungsten alloy

Examples

Experimental program
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Effect test

Embodiment approach 1

[0021] Embodiment 1: The rapid preparation method of the copper-tungsten alloy of this embodiment is:

[0022] (1) The metal tungsten powder and copper powder were ball milled and mixed according to the mass percentage of 92wt%: 8wt%, and the ball milled

[0023] According to the ball-to-material ratio of 50:1 and the speed of 100r / min, ball milling was carried out for 40 minutes; the particle size of metal tungsten powder and copper powder was 10-20 μm, and the purity was greater than 99.8wt%.

[0024] (2) Press the tungsten powder and copper powder mixed by ball milling in step (1) into a compact, and the pressure is controlled at 30MPa to make a cylindrical tungsten skeleton compact;

[0025] (3) Put the tungsten skeleton block into the mullite crucible, and cover the tungsten skeleton block with copper powder with a thickness of 3mm, and then place it under the conditions of microwave frequency 2400MHz, power 5KW, and vacuum degree 0.08KPa. Maintain a heating rate of 20°C...

Embodiment approach 2

[0026] Embodiment 2: The rapid preparation method of the copper-tungsten alloy of this embodiment is:

[0027] (2) The metal tungsten powder and copper powder are ball milled and mixed according to the mass percentage of 80wt%: 20%.

[0028] According to the ball-to-material ratio of 30:1 and the speed of 200r / min, ball milling was performed for 20 minutes; the particle size of metal tungsten powder and copper powder were both less than 200 mesh, and the purity was greater than 99.8wt%.

[0029] (2) Press the tungsten powder and copper powder mixed by ball milling in step (1) into a compact, and the pressure is controlled at 45MPa to make a tungsten skeleton compact;

[0030] (3) Put the tungsten skeleton block into the mullite crucible, and cover the tungsten skeleton block with copper powder with a thickness of 2mm, and then place it under the conditions of microwave frequency 2500MHz, power 3KW, and vacuum degree less than 0.1KPa , maintain a heating rate of 15°C / min, rais...

Embodiment approach 3

[0031] Embodiment 3: The rapid preparation method of the copper-tungsten alloy of this embodiment is:

[0032] (1) The metal tungsten powder and copper powder are ball milled and mixed according to the mass percentage of 95wt%: 5%, and the ball milled

[0033] According to the ball-to-material ratio of 1:1 and the speed of 300r / min, ball milling was performed for 10 minutes; the particle size of metal tungsten powder and copper powder were both less than 200 mesh, and the purity was greater than 99.8wt%.

[0034] (2) Press the tungsten powder and copper powder mixed by ball milling in step (1) into a compact, and the pressure is controlled at 25MPa to make a tungsten skeleton compact;

[0035] (3) Put the tungsten skeleton block into the mullite crucible, and cover the tungsten skeleton block with copper powder with a thickness of 5mm, and then place it under the conditions of microwave frequency 2450MHz, power 3.5KW, and vacuum degree less than 0.1KPa , maintain a heating ra...

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Abstract

The invention relates to a rapid preparation method of a copper-tungsten alloy, and belongs to the fields of a powder metallurgy technology, a metallurgical new technology and a microwave sintering technology. The method comprises the following steps: carrying out ball milling mixing of metallic tungsten powder and copper powder according to a proportion ratio of 95-70wt%:5-30wt%, carrying out briquet pressing to prepare a tungsten skeleton briquet, filling into a mullite crucible, distributing the copper powder surrounding the tungsten skeleton briquet, putting the crucible under conditions comprising a microwave frequency of 2400-2500MHz, a power of 3-5KW and a degree of vacuum of below 0.1KPa, sintering for 1-3h by heating to 1100-1300DEG C at a heating speed of 15-20DEG C / min, and naturally cooling to obtain the copper-tungsten alloy. The copper-tungsten alloy prepared through the method has a uniform structure and a compact structure, and has a relative density reaching 98.7%.

Description

technical field [0001] The invention relates to the fields of powder metallurgy technology, new metallurgical technology and microwave sintering technology, in particular to a rapid preparation method of copper-tungsten alloy. Background technique [0002] Copper-tungsten alloy not only has the high melting point, high density, electric corrosion resistance, welding resistance and high high temperature strength of W, but also has the high electrical and thermal conductivity, plasticity and processability of Cu. Because Cu can absorb a large amount of arc energy when it evaporates at high temperature in the arc, reduce the arc temperature, improve the use conditions and reduce the electric corrosion, it is widely used as the electrical contact material of high-voltage electrical appliances, and also used as the electrode of electric processing, High-temperature molds and other occasions that require electrical and thermal conductivity and high-temperature use. At present, th...

Claims

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Application Information

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IPC IPC(8): C22C1/04C22C27/04
Inventor 许磊彭金辉李云张利波刘秉国夏仡夏洪应周俊文巨少华代林晴魏亚乾
Owner KUNMING UNIV OF SCI & TECH
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