6115results about "Glass severing apparatus" patented technology

Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

A chip having a desired shape is formed from a platelike workpiece. The chip manufacturing method includes a shield tunnel forming step of applying a pulsed laser beam to the workpiece from a focusing unit included in a pulsed laser beam applying unit along the contour of the chip to be formed, with the focal point of the pulsed laser beam set at a predetermined depth from the upper surface of the workpiece, thereby forming a plurality of shield tunnels inside the workpiece along the contour of the chip to be formed. Each shield tunnel has a fine hole and an amorphous region formed around the fine hole for shielding the fine hole. In a chip forming step, ultrasonic vibration is applied to the workpiece to break the contour of the chip where the shield tunnels have been formed, thereby forming the chip from the workpiece.

A laser processing method which can highly accurately cut objects to be processed having various laminate structures is provided. An object to be processed comprising a substrate and a laminate part disposed on the front face of the substrate is irradiated with laser light L while a light-converging point P is positioned at least within the substrate, so as to form a modified region due to multiphoton absorption at least within the substrate, and cause the modified region to form a starting point region for cutting. When the object is cut along the starting point region for cutting, the object 1 can be cut with a high accuracy.

[Object] To provide a method of manufacturing a reinforced plate glass by which glass surface strength can be sufficiently increased, and a stable quality reinforced plate glass is manufactured at high production efficiency, and to provide a reinforced plate glass manufactured by the manufacturing method.[Solving Means] A reinforced plate glass (10) is formed of an inorganic oxide glass, and is provided with a compression stress layer by chemical reinforcement on plate surfaces (11, 12) opposed to each other in a plate thickness direction. Plate end faces (13, 14, 15, 16) have regions where a compression stress is formed and regions where no compression stress is formed.

A high transmission and low iron glass is provided for use in a solar cell. The glass substrate may be patterned on at least one surface thereof. Antimony (Sb) is used in the glass to improve stability of the solar performance of the glass upon exposure to ultraviolet (UV) radiation and / or sunlight. The combination of low iron content, antimony, and / or the patterning of the glass substrate results in a substrate with high visible transmission and excellent light refracting characteristics.

Methods for separating glass articles from strengthened glass substrate sheets and strengthened glass substrate sheets are provided. In one embodiment, a method includes forming at least one groove on at least one surface of the glass substrate sheet and strengthening the glass substrate sheet by a strengthening process. The groove defines the glass article and partially extends through a thickness of the glass substrate sheet. The method further includes generating an initiation defect on the groove at an initiation location to cause a through crack to self-propagate through the glass substrate sheet along the groove, thereby separating the glass article from the glass substrate sheet. In another embodiment, a strengthened glass substrate sheet includes a strengthened glass having a glass article groove and an initiation groove on a surface, the glass article groove defining a glass article.

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

A glass laminate substrate for electronic substrates, such as flat panel displays, includes a transparent glass core bounded by transparent glass skin layers, wherein the coefficient of thermal expansion of the core is greater than the coefficient of thermal expansion of the skin layers thereby forming a residual compressive stress in the skin layers and a residual tensile stress in the core. The relative thickness of the skin layers can be selected to enhance the strength of the glass laminate substrate while maintaining a sufficiently low residual tensile stress in the core to allow scribing and separating of the substrate to size. Interlayers can be located between the core and the skin layers, wherein the interlayers include a residual compressive stress, and produce a reduced residual tensile stress in the core.

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

To provide cover glass for mobile terminals exhibiting high strength in a thin plate thickness state to enable reductions in thickness of apparatuses when inserted in the apparatuses, cover glass (1) for a mobile terminal of the invention is cover glass (1) that is obtained by forming a resist pattern on main surfaces of a plate-shaped glass substrate, then etching the glass substrate with an etchant using the resist pattern as a mask, and thereby cutting the glass substrate into a desired shape and that protects a display screen of the mobile terminal, where an edge face of the cover glass (1) is formed of a molten glass surface, and as surface roughness of the edge face, arithmetic mean roughness Ra is 10 nm or less.

The present invention disclose a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated.

A method for cutting a glass article from a strengthened glass substrate having a surface compression layer and a tensile layer includes forming an edge defect in the surface compression layer on a first edge of the strengthened glass substrate. The method further includes propagating a through vent through the surface compression and tensile layers at the edge defect. The through vent precedes a region of separation along a cut line between the glass article and the strengthened glass substrate.

Systems and methods for improving strength of thin displays, such as Liquid Crystal Display (LCD) displays, are disclosed. In one embodiment, a display can use an asymmetrical arrangement of layers (e.g., glass layers) where one layer is thicker than another layer. Different scribing techniques can also be used in singulating the different layers. The asymmetrical arrangement and / or scribing techniques can facilitate displays that are not only thin but also adequately strong to limit susceptibility to damage.

Apparatus, systems and methods for improving strength of a thin glass member for an electronic device are disclosed. In one embodiment, the glass member can have improved strength by using multi-bath chemical processing. The multi-bath chemical processing allows greater levels of strengthening to be achieved for glass member. In one embodiment, the glass member can pertain to a glass cover for a housing of an electronic device.

Thin substrates, such as flat glass panels, are levitated on a porous media air bearing creating a pressurized film of air and preloaded against the air film by negative pressure areas. The pressure can be distributed most uniformly across the pressure areas by defusing the pressure through a porous medium. Such a bearing can be used for glass flattening by holding the glass such that the unevenness is migrated to the side opposite the side to be worked on.

The present invention generally relates to a system that can be used to form a photovoltaic device, or solar cell, using processing modules that are adapted to perform one or more steps in the solar cell formation process. The automated solar cell fab is generally an arrangement of automated processing modules and automation equipment that is used to form solar cell devices. The automated solar fab will thus generally comprise a substrate receiving module that is adapted to receive a substrate, one or more absorbing layer deposition cluster tools having at least one processing chamber that is adapted to deposit a silicon-containing layer on a surface of the substrate, one or more back contact deposition chambers, one or more material removal chambers, a solar cell encapsulation device, an autoclave module, an automated junction box attaching module, and one or more quality assurance modules that are adapted to test and qualify the completely formed solar cell device.

Improved techniques are disclosed for fabrication of touch panels using thin sheet glass, coupling external circuitry, and securely holding the touch panel within a portable electronic device. The thin sheet glass may be chemically strengthened and laser scribed.

Starting point regions for cutting 8a, 8b extending along lines to cut 5a, 5b are initially formed in an object to be processed 1. The starting point regions for cutting 8b have modified regions 7b formed by irradiating the object 1 with laser light while locating a converging point within the object 1 and are formed in parts extending along the lines to cut 5b excluding portions 34b intersecting the lines to cut 5a. This makes the starting point regions for cutting 8b much less influential when cutting the object 1 from the starting point regions for cutting 8a acting as a start point, whereby bars with precise cleavage surfaces can reliably be obtained. Therefore, it is unnecessary to form a starting point region for cutting along the lines to cut 5b in each of a plurality of bars, whereby the productivity of semiconductor laser elements can be improved.

Methods for separating strengthened glass articles from glass substrate sheets and strengthened glass substrate sheets are described herein. In one embodiment, a method of separating a glass article from a glass substrate sheet includes forming at least one groove on at least one surface of the glass substrate sheet. The at least one groove continuously extends around a perimeter of the glass article and extends partially through a thickness of the glass substrate sheet. The method further includes strengthening the glass substrate sheet by a strengthening process and separating the glass article from the glass substrate sheet along the at least one groove such that one or more edges of the glass article are under compressive stress. In another embodiment, a strengthened glass substrate sheet includes an ion exchanged glass having one or more grooves in one or more strengthened surface layers, the one or more grooves defining glass articles.

A method for machining and releasing closed forms from a transparent, brittle substrate includes using a burst of ultrafast laser pulses to drill patterns of orifices in the substrate. Orifices are formed by photoacoustic compression and they extend completely or partially in the transparent substrate. A scribed line of spaced apart orifices in the transparent substrate comprise a closed form pattern in the substrate. A heat source is applied in a region about said scribed line of spaced apart orifices until the closed form pattern releases from the transparent substrate.

A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within + / −100 μm of the front surface of the glass piece most desirably within + / −50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within + / −30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.