The invention relates to a production method of a
silicon wafer cutting blade material. The production method of the
silicon wafer cutting blade material uses high-purity green
silicon carbide as the
raw material and comprises the following steps: performing jaw crushing, screening, performing automatic circulation type wet ball milling and hydraulic
cyclone classification, performing automatic overflow carbon removal, performing
magnetic separation to automatically remove iron, performing alkali washing, cleaning, performing overflow classification under
automatic control of a
programmable logic controller (PLC), centrifuging to dewater,
drying, mixing, performing fine screening and the like. The
silicon carbide blade material prepared by the method has equiareal shape, sharp edges and high
cutting capability; the blade material particles have large specific surface area and
clean appearance and high suitability to
cutting fluid such as
polyethylene glycol; the product ground by automatic circulation type wet ball milling and
cyclone classification has more equiareal shapes, good
grain shape and high yield, and overgrinding can be avoided; and automatic
magnetic separation is adopted to perform acid-free
iron removal, thus the method has high efficiency, environmental friendliness and high degree of
automation and is suitable for large-scale production. The product ground by the method has high particle size concentration degree and good
grain shape, and better cutting effect can be realized.