2648 results about "Scratching" patented technology

After a hole is formed in a polishing pad, a transparent window plate is inserted into the hole. Here, a gap is left between the upper surface of the transparent window plate and the outermost surface constituting the working surface of the polishing pad. During polishing, the polishing head holding the wafer applies a load to the polishing pad by means of a load-applying mechanism, so that the polishing pad and transparent window plate are compressed. In this case, the system is arranged so that the gap remains constant, and so that a dimension equal to or greater than a standard value is maintained. Since the upper surface of the transparent window plate is recessed from the upper surface of the polishing pad, there is no scratching of the surface of the transparent window plate during dressing. Accordingly, the polishing pad has a long useful life.

A method for reducing wafer surface scratching in a metal CMP process including providing a semiconductor wafer having a process surface comprising a blanket deposited metal layer; dry etching in an etchback process comprising a fluorine containing etching chemistry to remove at least a portion of the metal layer forming a metal and fluorine containing etching residue at the process surface; cleaning the process surface with a hydrofluoric acid (HF) containing cleaning solution; and carrying out a subsequent metal chemical mechanical polishing (CMP) process.

An ion exchangeable glass having a high degree of resistance to damage caused by abrasion, scratching, indentation, and the like. The glass comprises alumina, B2O3, and alkali metal oxides, and contains boron cations having three-fold coordination. The glass, when ion exchanged, has a Vickers crack initiation threshold of at least 10 kilogram force (kgf).

The invention discloses a three-dimensional printing forming material with toughness and high adhesive property. The three-dimensional printing forming material comprises a powder material and an adhesive material and is characterized in that the powder material comprises the following components in parts by weight: 40-85 parts of polyamide resin, 5-40 parts of pigments, 5-30 parts of filler, 1-6 parts of pigment and filler dispersing and wetting aid, 0.1-1.5 parts of flatting agent and 0.1-0.5 part of degassing agent; the adhesive material comprises the following components in parts by weight: 60-95 parts of epoxy resin, 5-40 parts of filler, 1-10 parts of toughening agent, 0.1-1.5 parts of flatting agent, 1-4 parts of pigment and filler dispersing and wetting aid, 0.1-0.5 part of degassing agent and 0.1-0.5 parts of powder flowing aid; and when the three-dimensional printing forming material is used, 1 part by weight of powder material and 0.01-0.5 part by weight of adhesive material are cooperatively used. A solid component printed by using the material disclosed by the invention has the advantages of higher adhesion strength and firmness, good flexibility and scratching resistance.

A tool-carrying assembly to be secured by a waist-encircling belt, and, additionally, by straps encircling the legs of a workman using the belt assembly. The assembly is thus stabilized, and enhanced weight distribution is achieved. Elements of the belt assembly include a waist-encircling band supporting a pair of laterally spaced, depending panels each carrying tool-accepting pockets. The pockets preferably carry visual markings and coding as well as other indicia identifying clearly the specific tools to be "housed" or carried in and to be returned to each pocket after use. Inventory control of the tools is thereby significantly enhanced. Pivotal flaps depending from the band-carried panels serve to cover the tools when not in use, and to prevent the tools from scratching or otherwise marring any article, or fixture, or "workpiece" requiring the workman's attention. The panels and the tools carried thereby are disposed in lateral, spaced zones at the wearer's sides (and not directly in the front of one's body) thus further to reduce any likelihood of the tools coming into damaging physical contact with an article being worked upon. That is, both frontal and rearwardly located zones about the wearer of the tool belt assembly are rendered essentially free and clear of all tools and other mechanical impediments. While wearing the tool assembly of the invention, a worker can, without any discomfort, lie upon and use a "creeper". Significantly, a frontal sector of the belt itself is covered with a relatively soft, non-marring protective pad, composition, or surface material effective to prevent possible damage from a workman's belt buckle. An additional feature of the invention is that the panels may be structured to constitute a core sandwiched between a pair of encasing sheet-like webs. The resulting composite is readily formable to provide selectable visual patterns, designs or indicia, for example, to identify product name or sources and / or to constitute decorations.

An alignment tool, method and system are provided for aligning a robot blade in a workpiece handling system, in which the tool comprises a frame or fixture adapted to be supported by a transfer chamber support surface or other support surface in the system, in which the frame has one or more non-contact distance sensors positioned to measure the distance of a workpiece or robot blade from the sensor or a predetermined reference point or surface. In one embodiment, the frame is used to align a robot blade relative to a robot support alignment surface in a robot chamber. In another embodiment, the frame emulates a workpiece cassette and the distance sensors provide an output to align the robot blade to a cassette support alignment surface. As a consequence, accidental scratching and breakage of workpieces such as semiconductor wafers and display substrates may be reduced or eliminated. In another embodiment, positions of distance sensors may be readily repositioned to accommodate alignment procedures for different sized wafers or other workpieces.

After a hole is formed in a polishing pad, a transparent window plate is inserted into the hole. Here, a gap is left between the upper surface of the transparent window plate and the outermost surface constituting the working surface of the polishing pad. During polishing, the polishing head holding the wafer applies a load to the polishing pad by means of a load-applying mechanism, so that the polishing pad and transparent window plate are compressed. In this case, the system is arranged so that the gap remains constant, and so that a dimension equal to or greater than a standard value is maintained. Since the upper surface of the transparent window plate is recessed from the upper surface of the polishing pad, there is no scratching of the surface of the transparent window plate during dressing. Accordingly, the polishing pad has a long useful life.

An alignment tool, method and system are provided for aligning a cassette handler to a robot blade in a workpiece handling system, in which the tool comprises a frame or fixture adapted to be supported by the cassette handler support surface, in which the frame has one or more distance sensors positioned to measure the distance of a workpiece or robot blade from the sensor or a predetermined reference point or surface. In a preferred embodiment, the frame emulates a workpiece cassette and the distance sensors provide a numerical output of the distance to the workpiece. As explained in greater detail below, these distance measurements facilitate accurately leveling and aligning the cassette handler support surface relative to a workpiece supported by the robot blade such that when the frame is replaced by an actual workpiece cassette, the workpiece cassette will also be level and aligned with respect to the robot blade and the workpiece held by the blade. As a consequence, accidental scratching and breakage of workpieces such as semiconductor wafers and display substrates may be reduced or eliminated.