Three-dimensional printing forming material with toughness and high adhesive property and preparation method thereof
A technology for 3D printing and molding materials, applied in the field of high-bonding 3D printing molding materials and their preparation, can solve the problems of printing molding, high printing conditions, brittle and fragile parts, etc., and improve the bonding fastness and strength , high bond strength and fastness, increase the effect of bond strength and fastness
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Embodiment 1
[0032] A tough and highly cohesive 3D printing molding material, its formula is as follows:
[0033] 1. Powder material (by weight)
[0034] Polyamide resin (melting point about 230-260°C, BASF, Germany): 40 parts
[0035] Titanium dioxide: 15 parts
[0036] Lithopone: 10 parts
[0037] Talc powder: 23 parts
[0039] Polymethyl methacrylate 701: 0.3 parts
[0040] Polypropylene wax: 0.2 parts
[0041] Benzoin: 0.5 parts
[0042] 2. Adhesive material (by weight)
[0043] Epoxy resin SK-0430 (Jiangsu Changzhou Shangke Special Polymer Material Co., Ltd.): 60 parts
[0044] Wollastonite: 5 parts
[0045] Castor Oil: 10 parts
[0046] Polymethyl methacrylate 701: 0.1 parts
[0047] Polyethylene wax: 4 parts
[0048] Benzoin: 0.1 parts
[0049] Vapor-phase SiO 2 : 0.5 parts
[0050] Preparation:
[0051] A. The powder material is prepared by the melting method production process: put the raw material of the formula into the batching tan...
Embodiment 2
[0059] A tough and highly cohesive 3D printing molding material, its formula is as follows:
[0060] 1. Powder material (by weight)
[0061] Polyamide resin (melting point: 285-300°C, American Dow Chemical): 60 parts
[0062] Titanium dioxide: 20 parts
[0063] Lithopone: 20 parts
[0064] Talc powder: 5 parts
[0065] Polyethylene wax: 4 parts
[0066] Hydrogenated pinoresinol: 0.1 parts
[0067] PTFE modified polypropylene wax: 2 parts
[0068] Benzoin: 0.1 parts
[0069] 2. Adhesive material (by weight)
[0070] Epoxy resin SK-0430 (Changzhou Shangke Special Polymer Material Co., Ltd., Jiangsu): 70 parts
[0071] Kaolin: 40 parts
[0072] Triphenyl phosphite: 3 parts
[0073] Polymethylmethacrylate 701: 1 part
[0074] Polyethylene wax: 1.5 parts
[0075] Benzoin: 0.3 parts
[0076] Precipitated SiO 2 : 0.2 parts
[0077] Preparation:
[0078] A. The powder material is prepared by the melting method production process: put the raw material of the formula int...
Embodiment 3
[0087] A tough and highly cohesive 3D printing molding material, its formula is as follows:
[0088] 1. Powder material (by weight)
[0089] Polyamide resin (melting point: 310-320°C, BASF, Germany): 85 parts
[0090] Titanium dioxide: 2 parts
[0091] Lithopone: 3 parts
[0092] Talc powder: 30 parts
[0093] Polyamide wax: 1 part
[0094] Polyethylene wax: 0.3 parts
[0095] Hydrogenated pinoresinol: 1.5 parts
[0096] Benzoin: 0.2 parts
[0097] 2. Adhesive material (by weight)
[0098] Epoxy resin DER667-20 (U.S. Dow Chemical): 95 parts
[0099] Kaolin: 18 parts
[0100] Castor oil: 1 part
[0101] Polymethyl methacrylate 701: 1.5 parts
[0102] Polyethylene wax: 1 part
[0103] Benzoin: 0.5 parts
[0104] Precipitated SiO 2 : 0.1 part
[0105] Preparation:
[0106] A. The powder material is prepared by the melting method production process: put the raw material of the formula into the batching tank, stir and disperse at a speed of 1500rpm for 30min; pass t...
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