3423results about How to "Achieve preparation" patented technology

The invention discloses a three-dimensional weaving forming method for a composite material, and belongs to the cross field of weaving and manufacturing. The method comprises the following steps of: performing layered design according to the characteristics of a part structure, and optimizing a weaving path; arranging weaving guide posts on a controllable digital arrangement template at intervals according to certain rules; after a guide sleeve passes through the hollow guide posts along the Z direction and is turned outwards, fixing the guide sleeve on the controllable digital template; selecting a silk material for weaving the layer; after the weaving of one layer is finished, lowering the controllable digital arrangement template, and driving the guide sleeve to expose for a distance to form a new layer of arrangement template; weaving layer by layer till the weaving of the whole part is finished; detaching and sewing the part; and soaking the part into resin to form a composite material part. According to the method, the quick prototyping technology and the weaving technology are organically combined to realize three-dimensional weaving of the complex functional part; and meanwhile, composite material preparation and part formation are integrated, so that manufacture of the complex functional part is realized.

The invention provides a method for manufacturing a circuit board layer-adding structure. Manufacture of a fine circuit with the width smaller than 50 micrometers is achieved, use of insulation materials with high cost is avoided, so that the process cost of a substrate is reduced, and therefore cost of the substrate is reduced. The method comprises the following steps that (1) an inner-layer circuit is manufactured; (2) copper foil and prepreg are pressed and solidified; (3) laser drilling is conducted; (4) smear removal is conducted; (5) surface copper is removed; (6) plasma activating treatment is conducted on the surface of a circuit board; (7) electroless copper plating is conducted; (8) photoetching is conducted; (9) electroplating is conducted; (10) membrane stripping is conducted; (11) flash etching is conduced. According to the method, generally-used medium material PP is adopted; through the improvement of the SAP technical method, the chemical activity of the surface of the PP is improved, electroless copper plating is directly conducted on the surface of the PP, the binding force of an electroless copper plating layer is improved, so that the SAP machining requirements of the fine circuit are satisfied, and meanwhile the technical cost of the substrate is reduced to a great extent.