The invention discloses a high-air-tightness low-free-
oxygen-content nano disperse
copper alloy and a short-process preparation technology, and wherein the
alloy components comprise Al2O3, Ca and La.The preparation technology is made by the following steps that preparing Cu-Al2O3
alloy powder by adopting an
internal oxidation method, and then mixing the Cu-Al2O3 alloy
powder with Cu-Ca-La alloy
powder, wrap covering the mixed powder under the protection of
argon, carrying out hot
extrusion at 900-920 DEG C and then rotary
forging, after rotary
forging, the wrap covering is vacuumized to be less than or equal to 10<-3>Pa, the wrap covering is sealed and is placed in a
nitrogen atmosphere with the temperature of 450-550 DEG Cand the pressure intensity of 40-60 Mpa for 3-5 hours. According to the preparation technology disclosed by the invention, the secondary
solid reduction of Ca and La is utilized, so that residual free
oxygen is effectively removed and the dispersion strengthening effect is achieved, and finally the
high density is obtained through vacuum medium-temperature
creep deformation. The disperse
copper prepared by the invention has the advantages that low free
oxygen content (<= 15ppm),
high dimensional stability and good
air tightness after
hydrogen annealing, good in gas tightness, the gas
leakage rate is less than or equal to 1.0*10<-10> Pa.m<3> / s, the preparation technology is suitable for industrial production and can be used as a variety of sealing device materials such as an electric vacuum shell sealing device and a novel energy automobile high-voltagedirect-current
relay.