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High-air-tightness low-free-oxygen-content nano disperse copper alloy and short-process preparation technology

A technology of preparation process and oxygen content, applied in metal processing equipment, transportation and packaging, etc., can solve the problems of high free oxygen content of nano-dispersed copper alloy, low free oxygen content of nano-dispersed copper alloy, low air tightness, etc., to achieve Low free oxygen content, high dimensional stability, and good air tightness

Active Publication Date: 2019-06-18
湖南高创科惟新材料股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome existing internal oxidation and prepare Cu-Al 2 o 3 Nano-dispersed copper alloy has the problems of high residual free oxygen content and low air tightness. To provide a high air-tight and low free oxygen content nano-dispersed copper alloy and a short-flow preparation process

Method used

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  • High-air-tightness low-free-oxygen-content nano disperse copper alloy and short-process preparation technology

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Embodiment 1

[0039] The Cu-0.1wt%Ca-0.1wt%La alloy is smelted under inert gas protection at 1200°C, prepared by high-purity nitrogen atomization, sieved, and subjected to high-energy ball milling to obtain ultrafine powder (average particle size less than or equal to 20 microns). The Al and Cu are smelted at 1218-1230 ℃ to form a Cu-Al alloy with an Al content of 0.04wt%. The high-purity nitrogen atomization is used to prepare and sieve the alloy powder with a particle size of less than 40 meshes, which is mixed with an oxidant. Mix, perform ball milling, conduct internal oxidation with oxidizing agent at 386-395 °C for 2 hours, and then conduct internal oxidation at 892-900 °C for 3 hours, crush the above-mentioned internal oxidation powder, and reduce hydrogen at 885-893 °C For 6 hours, mix with Cu-Ca-La alloy ultrafine powder in a ratio of 15:1, cold isostatic pressing of the above mixed powder, argon chamber pure copper jacket, 900 ℃ water seal hot extrusion, extrusion ratio 15 : 1, sw...

Embodiment 2

[0043] The Cu-0.1wt%Ca-0.1wt%La alloy was smelted under inert gas protection at 1200°C, prepared by high-purity nitrogen atomization, sieved, and subjected to high-energy ball milling to obtain ultrafine powder (average particle size less than or equal to 20 microns). The Al and Cu are smelted at 1200-1222 ℃ to form a Cu-Al alloy with an Al content of 0.12wt%. Mix, perform ball milling, conduct internal oxidation of the mixed powder with an oxidant at 392-400 °C for 2 hours, and then oxidize at 893-898 °C for 3 hours, crush the above-mentioned internal oxidation powder, and reduce it with hydrogen at 895-900 °C for 6 hours, Mixed with Cu-Ca-La alloy ultrafine powder in a ratio of 13:1, cold isostatic pressing of the above powder, argon chamber pure copper jacket, 900 ℃ water sealing hot extrusion, extrusion ratio 15:1, Swaged after extrusion; re-swaged bar in new jacket, evacuated for 10 -3 After Pa, it was sealed and placed in a nitrogen atmosphere with a pressure of 50 MPa ...

Embodiment 3

[0047] The Cu-0.1wt%Ca-0.1wt%La alloy was smelted under inert gas protection at 1200°C, prepared by high-purity nitrogen atomization, sieved, and subjected to high-energy ball milling to obtain ultrafine powder (average particle size less than or equal to 20 microns). The Al and Cu are smelted at 1215-1230 ℃ to form a Cu-Al alloy with an Al content of 0.30wt%. The high-purity nitrogen atomization is used to prepare and sieve the alloy powder with a particle size of less than 40 meshes, which is mixed with an oxidant. Mix, perform ball milling, conduct internal oxidation of the mixed powder with an oxidizing agent at 382-393 °C for 2 hours, and then oxidize at 887-896 °C for 3 hours, crush the above-mentioned internal oxidation powder, and reduce it with hydrogen at 892-898 °C for 6 hours, Mixed with Cu-Ca-La alloy ultrafine powder in a ratio of 10:1, cold isostatic pressing of the above powder, argon chamber pure copper jacket, 900 ℃ water sealing hot extrusion, extrusion ratio...

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Abstract

The invention discloses a high-air-tightness low-free-oxygen-content nano disperse copper alloy and a short-process preparation technology, and wherein the alloy components comprise Al2O3, Ca and La.The preparation technology is made by the following steps that preparing Cu-Al2O3 alloy powder by adopting an internal oxidation method, and then mixing the Cu-Al2O3 alloy powder with Cu-Ca-La alloy powder, wrap covering the mixed powder under the protection of argon, carrying out hot extrusion at 900-920 DEG C and then rotary forging, after rotary forging, the wrap covering is vacuumized to be less than or equal to 10<-3>Pa, the wrap covering is sealed and is placed in a nitrogen atmosphere with the temperature of 450-550 DEG Cand the pressure intensity of 40-60 Mpa for 3-5 hours. According to the preparation technology disclosed by the invention, the secondary solid reduction of Ca and La is utilized, so that residual free oxygen is effectively removed and the dispersion strengthening effect is achieved, and finally the high density is obtained through vacuum medium-temperature creep deformation. The disperse copper prepared by the invention has the advantages that low free oxygen content (<= 15ppm), high dimensional stability and good air tightness after hydrogen annealing, good in gas tightness, the gas leakage rate is less than or equal to 1.0*10<-10> Pa.m<3> / s, the preparation technology is suitable for industrial production and can be used as a variety of sealing device materials such as an electric vacuum shell sealing device and a novel energy automobile high-voltagedirect-current relay.

Description

technical field [0001] The invention relates to a nano-dispersed copper alloy with high airtightness and low free oxygen content and a short-flow preparation process, in particular to a Cu-Al alloy with high airtightness and low free oxygen content 2 o 3 -CaO-La 2 o 3 Nano-dispersed copper alloy and short-flow preparation process. The invention belongs to the technical field of nano-dispersed copper alloy preparation. Background technique [0002] Nano-dispersion strengthened copper alloy is a new type of structural functional material with excellent comprehensive physical and mechanical properties. It has high strength, high electrical conductivity and good high temperature softening resistance. [0003] The existing technology mainly adopts internal oxidation method to prepare Cu-Al 2 o 3 The specific preparation process of nano-dispersion strengthened copper alloy is as follows: After melting the Cu-Al alloy with suitable composition, it is atomized and sprayed with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/05C22C1/10C22C9/00C22C32/00
CPCC22C1/058C22C9/00C22C1/0425B22F2998/10B22F2999/00C22C1/1078B22F9/082B22F2009/043B22F9/16B22F9/22B22F1/14B22F2201/11B22F3/14B22F2201/02B22F2003/208B22F9/04B22F2301/10B22F2302/253C22C1/05C22C32/0021B22F3/172B22F3/20
Inventor 李周邱文婷肖柱龚深
Owner 湖南高创科惟新材料股份有限公司
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