The invention is applicable to the technical field of solar cells, and provides a
processing technology of an IBC battery with a
passivation contact structure. The technology comprises the following steps: texturing and
polishing an N-type
monocrystalline silicon wafer, growing a tunneling
oxide layer on the back surface, depositing P-type / N-type doped
polycrystalline silicon on the back surface, performing
phosphorus diffusion on the front surface, depositing an antireflection layer on the front surface, and depositing a
passivation layer on the back surface;
etching the
passivation layer at the position of the P-type / N-type doped
polycrystalline silicon printing grid line by using
laser ablation to form a groove; utilizing
silver paste to carry out silk-
screen printing on grid lines in the groove corresponding to the P-type / N-type doped
polycrystalline silicon at one time; and
sintering at a low temperature of 400-690 DEG C to obtain a battery finished product. According to the
processing technology of the IBC battery with the passivation contact structure, the groove is etched at the position of the P-type / N-type doped polycrystalline
silicon printing grid line through
laser ablation,
ohmic contact between the grid line and the polycrystalline
silicon can be achieved through low-temperature
sintering, damage to the polycrystalline
silicon and the tunneling
oxide layer is avoided, the passivation effect of the battery is ensured, and
metal induced recombination in a grid line area is reduced, and the battery efficiency is improved.