177results about How to "Low warpage" patented technology

A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.

The invention discloses a glass fiber-reinforced PBT / PET (Polybutylece Terephthalate / Polyethyleneglycol Terephthalate) composite material and a preparation method thereof. The glass fiber-reinforced PBT / PET composite material consists of the following components in percentage by weight: 10-93.3 percent of PBT, 0.5-20 percent of PET, 0.5-20 percent of low shrink high molecular filler, 0.5-8 percent of compatilizer, 5-60 percent of glass fiber, 0-10 percent of toughening agent and 0.2-5 percent of aids, wherein the low shrink high molecular filler is one or more of an acrylonitrile-styrene-butadiene copolymer, an acrylonitrile-styrene-acrylic rubber copolymer and polycarbonate. The warping rate of glass fiber-reinforced PBT / PET composite material can be lowered effectively, and the performance of the material is improved; and the glass fiber-reinforced PBT / PET composite material can be widely applied to products such as automobile parts, electronic apparatuses and the like, and meets the requirements of large-sized thin-wall parts.

A stiff heat spreader element for making a cavity down plastic chip carrier having benefits of excellent heat dissipation property, low weight, small thickness, low warpage and low twist is disclosed. The stiff heat spreader element is formed by bonding a heat spreader and a thermally conductive sheet with using a first bonding sheet. The first bonding sheet is a prepreg or prepregs made of fiber-reinforced resin. A second bonding sheet is used to bond a circuit substrate and the stiff heat spreader element. The second bonding sheet is made of a single adhesive layer or a stack of adhesive layers. The adhesive layer is made of an adhesive material, or a flake-filled adhesive material, or short fiber-filled adhesive material, or a particle-filled adhesive material. The second bonding sheet is not a prepreg or prepregs. The circuit substrate has an opening to receive an electronic chip.

The invention relates to the technical field of 3D printing, in particular to a high-temperature-resistant nylon yarn material for 3D printing, a preparation method thereof and a method for performing 3D printing by applying the same. The high-temperature-resistant nylon yarn material contains the following raw materials in parts by weight: 90-100 parts of nylon resin, 1-10 parts of a reinforcing agent, 0.3-0.6 part of an antioxidant, and 0.1-0.3 part of a lubricant, wherein the reinforcing agent is organic modified montmorillonite. According to the invention, the high-strength nylon resin is used as a base material, the organic modified montmorillonite, the antioxidant and the lubricant are used for performing physical modification on the nylon resin, and the synergistic action among the components with different proportions is adjusted to improve the contractility and increase the thermal denaturation temperature of the nylon resin, so that the obtained high-temperature-resistant nylon yarn material for 3D printing is high in strength, low in shrinkage rate, low in warping deformation degree, and low in forming accuracy, and is high-temperature-resistant, and a support can be removed easily.

Provided are an active energy ray-curable composition for an optical material that has excellent low viscosity, shelf life, low foamability, low-temperature curability, low-warping performance, deep curability, heat-resistant and light-resistant transparency, rubber properties, cracking resistance, moisture permeation resistance and designability; a cured product; and production methods for obtaining the active energy ray-curable composition and the cured product. The active energy ray-curable composition for the optical material comprises (A) a vinyl polymer which has, per molecule, at least one methacryloyl group represented by the general formula (1) -OC(O)C(Ra)=CH2(1) (where Ra is a hydrogen atom or C1-C20 organic group) is produced by living radical polymerization, and has a color difference delta E* of 10 or less; (B) a light-induced radical polymerization initiator; and (C) at least one antioxidant selected from the group consisting of hindered phenol antioxidants, hindered amine antioxidants, and phosphorus antioxidants.

Disclosed is a urethane modified polyimide based flame retardant resin composition having excellent solubility in non-nitrogenous solvents, varnish stability, low temperature drying / curing, low warpage, flexibility, printability, and flame resistance, and also having excellent heat resistance, chemical resistance, electrical properties, and operability, and is low-cost. The urethane modified polyimide based flame retardant resin composition is characterized by containing: (A) a urethane modified polyimide based resin having urethane bonds and generated having as essential components (a) trivalent and / or 4-valent polycarboxylic acid derivatives having an acid anhydride group, (b) diol compounds, and (c) aliphatic polyamine residue derivatives and / or aromatic polyamine residue derivatives; (B) an epoxy resin having two or more epoxy groups per molecule; (C) an organic or inorganic filler; and, (D) a non-halogen-based flame retardant, wherein the non-halogen-based flame retardant (D) contains two essential components (D-1 and D-2), wherein, in an air atmosphere at 350 DEG C, the rate of weight reduction of one component (D-1) is greater than or equal to 50% and less than or equal to 90%, and that of the other component (D-2) is greater than or equal to 0% and less than or equal to 20%.

The invention is suitable for the technical field of modified plastic alloys, and provides a PC / PBT alloy material and a preparation method thereof. The PC / PBT alloy material comprises, by weight, 10-55 parts of polycarbonate, 10-55 parts of polybutylene telephthalate, 3-8 parts of a filler, 10-25 parts of a glass fiber, 1-10 parts of an irregular-section glass fiber, 0.2-1 part of a coupling agent, 2-6 parts of a flexibilizer A, 2-6 parts of a flexibilizer B, 0.1-0.5 parts of a main antioxidant, 0.2-0.5 parts of an auxiliary antioxidant, and 0.1-2 parts of other assistants. The PC / PBT alloy material has the advantages of good mechanical performances, low temperature resistance, impact resistance, warp resistance and processability. The preparation method of the PC / PBT alloy material has the advantages of simple flow, reasonable and controllable technological conditions, and suitableness for the industrial production.

Provided is a method for producing a modified polyimide containing a polycarbonate, and having excellent electrical characteristics and adhesiveness, and excellent heat resistance, flexibility, flexion, chemical resistance, storage stability, and low warpage. Also disclosed are said modified polyimide, a composition containing said polyimide, and applications therefor. In this method, tetracarboxylic dianhydride oligomer containing a polycarbonate component is synthesized by reacting tetracarboxylic dianhydride with an isocyanate-terminated oligomer containing a polycarbonate component and having excellent flexibility. Subsequently, this oligomer is reacted with an aromatic diamine and an aromatic tetracarboxylic dianhydride to form a polyimide block copolymer.; According to this method, a broad range of aromatic diamines can be selected, and by appropriately selecting the aromatic diamine, it is possible to produce an excellent modified polyimide which is capable of simultaneously satisfying the aforementioned characteristics.

The present invention relates to a carboxyl group-containing polyurethane obtained by making (a) a polyisocyanate compound, (b) a polycarbonate diol having a molecular weight of 300 to 50,000, (c) a dihydroxy compound having a carboxyl group and, if necessary, (d) a monohydroxy group. Compounds are reacted to obtain a thermosetting composition using the carboxyl group-containing polyurethane, and a paste for forming a film using the thermosetting composition. The thermosetting compositions of the present invention have excellent substrate adhesion, low warpage, plating resistance and solder heat resistance.

The invention provides a fiber reinforced PPS / PS composite material and a product thereof. The fiber reinforced PPS / PS composite material comprises the following materials by weight: thermoplastic resin, which includes 35 to 50 parts of PPS polymer and 0.1 to 10 parts of PS resin; a reinforced filling material, which includes 40 to 60 parts of flat envelope glass fiber and 0.5 to 2 parts of a granular glass filling material; and 0.5 to 2 parts of a compatilizer. According to the fiber reinforced PPS / PS composite material and the product thereof, PPS resin, the flat envelope glass fiber and fibrous filling materials except the flat envelope glass fiber are used as a matrix, the PS resin and hollow glass beads are added, and through addition of the PS resin and compatibilization of the compatilizer, fluidity and impact strength are improved, so a reinforced composite resin composition with higher mechanical strength, higher fluidity and lower warping performance is formed.

The present invention enables to provide a highly durable protective coating film or adhesive layer for high-density optical disks with less warp, which is superior in transmission for blue lasers, transparency and low water-absorption, by using an ultraviolet-curing resin composition essentially comprising a compound (A) represented by the following general formula (I) (wherein, R represents each independently a hydrogen atom or a C1-C3 alkyl group, and n and m each represents the number of repetition from 0 to 5) and a photopolymerization initiator.