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Thermosetting resin composite and cured resin

A resin composition, thermosetting technology, applied in the direction of coating non-metallic protective layer, printed circuit secondary treatment, etc., to achieve the effect of low-cost productivity and high productivity

Active Publication Date: 2009-04-01
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

By using such a carboxyl group-containing polyurethane resin in combination with an epoxy resin as a thermosetting component, the above-mentioned problems of the conventional solder resist ink can be solved, but there is still room for improvement in properties such as solder heat resistance

Method used

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  • Thermosetting resin composite and cured resin
  • Thermosetting resin composite and cured resin

Examples

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Effect test

Embodiment

[0055] Examples and comparative examples are shown below to describe the present invention concretely, but the present invention is not limited to the following examples. In addition, the following "parts" and "%" are mass standards unless otherwise indicated.

Synthetic example 1

[0057] Into a reaction vessel equipped with a stirring device, a thermometer, and a condenser, put 360 g (0.45 mol) of polycarbonate derived from 1,5-pentanediol and 1,6-hexanediol as a compound having two or more alcoholic hydroxyl groups. Ester diol (manufactured by Asahi Kasei Chemical Co., Ltd., number average molecular weight: 800), 81.4 g (0.55 mol) of dimethylol butyric acid, and 11.8 g (0.16 mol) of n-butanol as a molecular weight modifier (reaction terminator). Next, 151.2 g (1.08 mol) of hexamethylene diisocyanate, which is a compound having an isocyanate group that is not directly bonded to an aromatic ring, is charged, heated to 60° C. while stirring, and stopped at the moment when the temperature in the reaction vessel starts to drop. Heating again, continuing stirring at 80°C, confirming the absorption spectrum of isocyanate group with infrared absorption spectrum (2280cm-1 ) disappears and the reaction is terminated. Next, carbitol acetate was added until the so...

Synthetic example 2

[0059] Into a reaction vessel equipped with a stirring device, a thermometer, and a condenser, 360 g (0.45 mol) of a compound derived from 1,5-pentanediol and 1,6-hexanediol, which are compounds having two or more alcoholic hydroxyl groups, were charged. Carbonate diol (manufactured by Asahi Kasei Chemical Co., Ltd., number average molecular weight: 800), 81.4 g (0.55 mol) of dimethylol butyric acid, and 11.8 g (0.16 mol) of n-butanol as a molecular weight modifier (reaction terminator). Next, 200.9 g (1.08 mol) of trimethylhexamethylene diisocyanate, which is a compound having an isocyanate group that is not directly connected to an aromatic ring, is put in, heated to 60° C. while stirring, stops, and the temperature in the reaction vessel starts Heat again when it is lowered, continue stirring at 80°C, and confirm the absorption spectrum of the isocyanate group with infrared absorption spectrum (2280cm -1 ) disappears and the reaction is terminated. Next, carbitol acetate w...

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Abstract

The present invention provides a thermosetting resin composition and the condensate thereof. The thermosetting resin composition is suitable for forming a flexible film which has excellent sealing property to substrate, excellent flexibility resistance, low warping, excellent heat resistance of solder, excellent chemical coating resistance and excellent chemical insulating property. The thermosetting resin composition comprises the following components: (A) carboxyl-containing polyurethane resin obtained from the compound which has isocyanate group which is not directly connected to aromatic nucleus, and (B) a thermosetting compound. The carboxyl-containing polyurethane resin is preferably a polyurethane resin which is obtained through the reaction of the following components: (a) a compound which has the isocyanate group which is not directly connected to aromatic nucleus, preferably aliphatic isocyanic ester compound or branched chain aliphatic isocyanic ester compound, (b) a compound which has more than two hydroxyl groups in one molecule, and (c) a compound which has one hydroxyl group and more than one phenolic hydroxyl group in one molecule.

Description

technical field [0001] The present invention relates to a thermosetting resin composition suitable for forming a flexible film excellent in adhesion to a substrate, folding resistance, low warpage, solder heat resistance, chemical gold plating resistance, electrical insulation, etc. Protective films and insulating materials made of cured products, protective films such as solder resists and interlayer insulating films used in the manufacture of printed circuit boards, especially in the manufacture of flexible printed circuit boards, and tape-carrying packaging layer, or the backlight of liquid crystal display, the protective film of the back electrode of the electroluminescent panel used in the display for displaying information, the protective film of the display panel of mobile phone, clock, car audio, etc., IC, super LSI sealing material, etc. is useful. Background technique [0002] The following types of solder resists are used in the manufacture of flexible printed wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L75/04C08L63/00C08G59/42H05K3/28
CPCC08G18/28C08G18/73C08G59/42C08L63/00C08L75/04H05K3/28
Inventor 米田一善有马圣夫峰岸昌司
Owner TAIYO HLDG CO LTD
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