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Resin composition and prepreg, metal foil laminated board and interlayer insulating film made therefrom

A technology of resin composition and prepreg, applied in the direction of metal layered products, synthetic resin layered products, applications, etc., can solve the problem of reducing the ring-opening temperature of benzoxazine resin, accelerating the ring-opening reaction of benzoxazine, mastering, etc. question

Active Publication Date: 2017-11-17
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Bismaleimide triazine resin (BT resin) of Mitsubishi Gas can be said to be a model for the application of bismaleimide and cyanate ester. Although it has successfully solved the problem of water absorption in the application of bismaleimide resin, And the patented technology has been disclosed, but its key technical points are still difficult for domestic technicians to grasp
Amines are epoxy resin curing agents. After the amine reacts with the epoxy resin, the epoxy resin ring-opens to produce a large number of hydroxyl groups, and the hydroxyl groups will reduce the ring-opening temperature of the benzoxazine resin and accelerate the opening of the benzoxazine. Ring reaction, so that a large number of hydroxyl groups and amino groups are rapidly generated in the system, which leads to the acceleration of the curing reaction of the entire system and narrows the rheological window

Method used

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  • Resin composition and prepreg, metal foil laminated board and interlayer insulating film made therefrom
  • Resin composition and prepreg, metal foil laminated board and interlayer insulating film made therefrom
  • Resin composition and prepreg, metal foil laminated board and interlayer insulating film made therefrom

Examples

Experimental program
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Effect test

Synthetic example 1

[0075] In a 500ml three-neck flask equipped with a stirrer, a reflux condenser and a thermometer, place it in an oil bath, add bisphenol A: 91.2g, p-phenylenediamine: 94.4g, formaldehyde: 48.0g; then add 80ml of ethanol and 20ml of toluene was used as a solvent, and the temperature was slowly raised to 75° C. and kept for 3 hours. During the process, the stirring state was kept continuously, and nitrogen was bubbled into the three-necked flask for protection. Above-mentioned reaction finishes, and after the product is cooled to room temperature, keep stirring and dropwise add methanol solution in the flask, to no longer having precipitate to separate out, stop stirring, leave standstill 24hr under room temperature, filter supernatant liquid, collect precipitate, will The precipitate was placed in a vacuum drying oven at 50°C and dried for 5 hours to obtain a diamine containing a benzoxazine structure, which was designated as N(BOZ)-1.

Synthetic example 2

[0077] In a 500ml three-neck flask equipped with a stirrer, a reflux condenser and a thermometer, place it in an oil bath, add bisphenol F: 79.2g, p-phenylenediamine: 94.4g, formaldehyde: 48.0g; then add 80ml of ethanol and 20ml of toluene was used as a solvent, and the temperature was slowly raised to 60° C. and kept for 5 hours. During the process, the stirring state was continuously maintained, and nitrogen was bubbled into the three-necked flask for protection. Above-mentioned reaction finishes, and after the product is cooled to room temperature, keep stirring and dropwise add methanol solution in the flask, to no longer having precipitate to separate out, stop stirring, leave standstill 24hr under room temperature, filter supernatant liquid, collect precipitate, will The precipitate was placed in a vacuum drying oven at 50°C and dried for 5 hours to obtain a diamine containing a benzoxazine structure, which was designated as N(BOZ)-2.

[0078] Modified resin example one ...

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Abstract

The invention discloses a resin composition. The resin composition comprises the following components by weight: (a) 40-90 parts of diamine modified bismaleimide resin containing a benzoxazine structure; (b) 10-30 parts of epoxy resin; and (c) 10-30 parts of cyanate ester. According to the invention, bismaleimide and diamine resin containing benzoxazine are subjected to pre-reaction at low temperature in priority, ring opening almost does not occur to benzoxazine at low temperature, a part of reaction groups are consumed through the pre-reaction, a prepolymer with certain molecular weight is formed, the steric hindrance of the benzoxazine ring-opening reaction is increased, the reaction rate of the benzoxazine structure in the resin structure is slowed down, the rheological reaction window of the resin composition is well adjusted, and the risk of dry pattern or white stripe defects occurring to the substrate during lamination of the resin composition is lowered.

Description

technical field [0001] The invention relates to a resin composition and a prepreg, a metal foil laminate and an interlayer insulating film made by using the resin composition, belonging to the technical field of electronic materials. Background technique [0002] The advancement of electronic technology is changing with each passing day. Portability and thinning have become the direction that electronic complete products have been pursuing. However, the thinning and thinning of complete electronic products requires the preparation of electronic products, including printed circuit boards, to be thinner. Therefore, it is necessary to The base material of copper clad laminate has high rigidity and anti-warping ability, so as to meet the structural support and processing requirements of printed circuit boards. [0003] In the prior art, the material prepared from the thermosetting resin composition with epoxy resin and its curing agent as essential components has the advantages ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L63/00C08L61/06C08K3/36C08K5/06C08G73/12B32B27/18B32B15/08B32B15/092B32B27/04
CPCB32B15/08B32B15/092B32B27/18B32B2260/021B32B2260/046B32B2270/00B32B2307/306B32B2307/54B32B2307/73B32B2457/08C08G73/121C08G73/126C08L79/085C08L2201/08C08L2203/20C08L2205/03C08L63/00C08L61/06C08K3/36C08K5/06
Inventor 戴善凯崔春梅肖升高陈诚黄荣辉季立富谌香秀任科秘
Owner SHENGYI TECH SUZHOU
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