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Urethane modified polyimide based flame retardant resin composition

A polyimide-based and urethane-based technology, which is applied in the field of urethane-modified polyimide-based resin compositions, can solve the problem of low warpage, inability to obtain non-nitrogen-based solvent solubility, and resistance to The problems such as the exudation of the burning agent can be prevented, and the effect of suppressing exudation, excellent operability and economy, and excellent flame retardancy can be achieved.

Active Publication Date: 2012-08-15
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These polyimide-based resin compositions can be used for flexible printed circuit boards, in addition to satisfying characteristics such as solder heat resistance and printing adaptability, and can also satisfy flame retardancy and low warpage, but in order to pass only phosphorus Nitrile flame retardant exhibits high flame retardancy, so it needs to be added in large amount, and there is a problem of leakage of flame retardant
[0020] As mentioned above, the prior art cannot satisfy (1) non-nitrogen solvent solubility and varnish stability, (2) low-temperature drying / curing properties, (3) low warpage, and (4) bendability at the same time. , (5) printing adaptability, (6) flame-retardant polyimide resin composition that can be used as a solder resist layer, a surface protection layer, an interlayer insulating layer or an adhesive layer

Method used

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  • Urethane modified polyimide based flame retardant resin composition
  • Urethane modified polyimide based flame retardant resin composition
  • Urethane modified polyimide based flame retardant resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0173] In order to express the effects of the present invention, examples are given below, but the present invention is not limited by them at all. In addition, the characteristic value described in an Example was measured by the following method.

[0174]

[0175] The urethane-modified polyimide resin was dissolved in N-methyl-2-pyrrolidone so that the polymer concentration would be 0.5 g / dl, and the solution viscosity was measured at 30° C. with a Ubbelohde viscometer. The inherent viscosity is defined by the following formula.

[0176] (Inherent logarithmic viscosity)=(lnηrel) / C

[0177] ln: natural logarithm

[0178]ηrel: Viscosity ratio of solution to pure solvent determined according to solvent fall time (-)

[0179] C: Concentration of solution (g / dl)

[0180]

[0181] Take about 15 mg of a separate flame retardant and a urethane-modified polyimide resin, and heat it from room temperature to 100 °C at a rate of 10 °C / min in an air atmosphere (20 ml / min) and keep...

manufacture example 1

[0237] 166.0 parts by mass of trimellitic anhydride (99.9% purity, 0.1% trimellitic acid content) and polypropylene oxide of bisphenol A were added to a 4-necked 2-liter detachable flask equipped with a stirrer, a cooling tube, a nitrogen gas inlet tube, and a thermometer. Adduct (trade name NEWPOL BP-5P manufactured by Sanyo Chemical Industry Co., Ltd., molecular weight 533) 86.3 parts by mass, polypropylene glycol (trade name SANNIX PPG2000 manufactured by Sanyo Chemical Industry Co., Ltd., molecular weight 2000) 108 parts by mass, hexamethylene 84.1 parts by mass of diisocyanate, 125.1 parts by mass of diphenylmethane-4,4'-diisocyanate, 493.5 parts by mass of γ-butyrolactone, and 1,8-diazabicyclo[5.4.0]- 1.5 parts by mass of 7-undecene, the internal temperature of the liquid was raised from 30°C to 160°C under a nitrogen stream and reacted for 5 hours, then added 246.8 parts by mass of diglyme for dilution and cooled to room temperature, thus obtaining Dark brown urethane-m...

manufacture example 2~5

[0239] Using the raw materials described in Table 1, perform polymerization in the same manner as in Example 1, and then cool to room temperature to obtain a dark brown urethane-modified polyimide resin solution A-2~ with a non-volatile content of 40% by mass. A-5.

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Abstract

Disclosed is a urethane modified polyimide based flame retardant resin composition having excellent solubility in non-nitrogenous solvents, varnish stability, low temperature drying / curing, low warpage, flexibility, printability, and flame resistance, and also having excellent heat resistance, chemical resistance, electrical properties, and operability, and is low-cost. The urethane modified polyimide based flame retardant resin composition is characterized by containing: (A) a urethane modified polyimide based resin having urethane bonds and generated having as essential components (a) trivalent and / or 4-valent polycarboxylic acid derivatives having an acid anhydride group, (b) diol compounds, and (c) aliphatic polyamine residue derivatives and / or aromatic polyamine residue derivatives; (B) an epoxy resin having two or more epoxy groups per molecule; (C) an organic or inorganic filler; and, (D) a non-halogen-based flame retardant, wherein the non-halogen-based flame retardant (D) contains two essential components (D-1 and D-2), wherein, in an air atmosphere at 350 DEG C, the rate of weight reduction of one component (D-1) is greater than or equal to 50% and less than or equal to 90%, and that of the other component (D-2) is greater than or equal to 0% and less than or equal to 20%.

Description

technical field [0001] The present invention relates to a urethane-modified polyimide-based resin composition which has excellent heat resistance and flexibility and is suitable for coating methods such as printing machines, dispensers, and spinners. The urethane-modified polyimide-based resin composition of the present invention is useful for solder resist layers, surface protection layers, interlayer insulating layers, adhesive layers, etc. of flexible printed wiring boards of electronic components. Background technique [0002] At present, flexible printed circuit boards are widely used in electronic equipment components that require flexibility and compactness, such as equipment mounting substrates for display devices such as liquid crystal displays and plasma displays, and inter-substrate relay cables for mobile phones, digital cameras, and portable game machines. , Operation switch board, etc. [0003] However, solder resist layers, surface protection layers, interlay...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G18/65C08K3/00C08K5/00C08K5/1545C08K5/5399C08L63/00
CPCC08G73/1035C08G18/345C08G18/4277C08G18/4808C08G18/4879C08K5/0066C08K5/5313C08K5/5399C08L63/00C08L75/04C08L79/08C08L2666/22
Inventor 青山知裕神田良辅
Owner TOYOBO CO LTD
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