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Modified polyimide and method for producing modified polyimide

一种聚酰亚胺、聚酰亚胺树脂的技术,应用在印刷电路制造、涂加非金属保护层、涂层等方向,能够解决耐热性降低等问题,达到密合性优异、耐化学药品性优异、可靠性高的效果

Active Publication Date: 2012-05-16
HEFEI HANZHIHE MATERIAL SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the solubility of imide oligomers with hydroxyl groups at the end, the structure between the hydroxyl group and the imide group must be aliphatic in essence, and the heat resistance tends to decrease.

Method used

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  • Modified polyimide and method for producing modified polyimide
  • Modified polyimide and method for producing modified polyimide
  • Modified polyimide and method for producing modified polyimide

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0049] The oligomer whose terminal is isocyanate represented by the above-mentioned general formula (II) used in the preparation method of the present invention can be obtained by making the polycarbonate diol represented by the general formula (VI) and the diol represented by the general formula (VII) isocyanate reaction to obtain,

[0050] [chemical formula 8]

[0051]

[0052] (In the formula, R independently represents an alkylene group with 1 to 18 carbon atoms, and m represents an integer of 1 to 20);

[0053] [chemical formula 9]

[0054]

[0055] (wherein, X represents an alkylene or arylene group with 1 to 18 carbon atoms or an alkylene group with 1 to 18 carbon atoms linked by an ether bond, ester bond, urethane bond or amide bond);

[0056] In the above general formula (VI), R is independently an alkylene group with 1 to 18 carbon atoms, preferably an alkylene group with 2 to 8 carbon atoms, and m is an integer of 1 to 20, preferably 6 An integer of ~16. The...

Embodiment 1~5 and comparative example 1~3

[0135] A flame-retardant modified polyimide resin composition was prepared by kneading the main ingredient and each additive component in the proportion shown in the following Table 2 with a planetary mixer manufactured by Primix Co., Ltd. Table 2 shows the results of evaluating the following items about each obtained flame-retardant modified polyimide resin composition.

[0136] Flexibility

[0137] Each flame retardant modified polyimide composition was coated on the substrate by screen printing with a stainless steel plate of 165-3D mesh (mesh), heated at 120°C for 60 minutes by a hot air oven, and then heated at 180°C. Heat up for 30 minutes. Copper foil F2-WS (18 μm) manufactured by Furukawa Corporation, Ltd. was used as the substrate. About the obtained polyimide film, the coated surface was bent 180 degrees outside, and the presence or absence of a crack in a dried film was visually judged. Judgment criteria are as follows.

[0138] ◯: The dried film has no cracks. ...

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PUM

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Abstract

Provided is a method for producing a modified polyimide containing a polycarbonate, and having excellent electrical characteristics and adhesiveness, and excellent heat resistance, flexibility, flexion, chemical resistance, storage stability, and low warpage. Also disclosed are said modified polyimide, a composition containing said polyimide, and applications therefor. In this method, tetracarboxylic dianhydride oligomer containing a polycarbonate component is synthesized by reacting tetracarboxylic dianhydride with an isocyanate-terminated oligomer containing a polycarbonate component and having excellent flexibility. Subsequently, this oligomer is reacted with an aromatic diamine and an aromatic tetracarboxylic dianhydride to form a polyimide block copolymer.; According to this method, a broad range of aromatic diamines can be selected, and by appropriately selecting the aromatic diamine, it is possible to produce an excellent modified polyimide which is capable of simultaneously satisfying the aforementioned characteristics.

Description

technical field [0001] The invention relates to a preparation method of a modified polyimide, a modified polyimide and an application of the modified polyimide. Background technique [0002] A flexible printed wiring board (hereinafter referred to as FPC) often has a coverlay film (coverlay film) for protecting wiring (copper foil pattern, etc.) on the outer surface thereof. In addition, polyimide resins, polyamideimide resins, polyurethane resins, epoxy resins, and the like are used as insulating protective films for flexible wiring boards and the like. In recent years, protective films more excellent in heat resistance have been expected, and various protective films made of polyimide excellent in heat resistance have been proposed. Into these resin components, polysiloxane, polycarbonate, polybutadiene, polyester, etc. are introduced as flexible components to impart properties such as flexibility, flex resistance, and low warpage to the cured film. [0003] Patent Docum...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08G18/34C08J5/18C08K7/16C08L79/08H05K3/28
CPCC08J5/18H05K2201/0154C09D179/08C08G73/1078C08J2379/08C08L79/08C08G18/44C08G73/1042C08G73/1035C08G18/10H05K3/285C08G18/346C08K3/013C08K3/016C08G18/34C08G73/10C08G69/36
Inventor 五岛敏之M.S.温许荣花
Owner HEFEI HANZHIHE MATERIAL SCI & TECH CO LTD
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