The invention discloses a manufacturing method for a thick copper foil copper-clad plate. The manufacturing method comprises the following steps: preparing a glue solution, gluing, overlapping and hot-pressing, wherein the glue solution comprises a low brominated epoxy resin / phenolic-cured system, a coupling agent, an imidazole curing catalyst and a nonorganic filler, and butanone is used as a solvent for preparation. Through the adjustment of the conditions of the production process, the problem that a super-thick copper-clad plate is difficult to manufacture is solved, the method is simple and quick, the manufactured super-thick copper-clad plate is better in smoothness, and the bonding force between super-thick copper foil and a substrate is better; besides, a large amount of excellent and efficient heat conducting fillers is added in the formula, so that the formed substrate has efficient heat conduction performance, the heat conduction rate of the formed substrate is larger than 1.6 W / mk, and a large current substrate can dissipate heat well; the manufactured super-thick and high-heat conductivity copper-clad plate has excellent heat resistance, T260 is longer than 30 min, and in addition, the requirement on the PCB lead-free process can also be met.