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Tough and high-elastic composite silicon-carbide-based ceramic circuit board base board material and preparation method thereof

A technology of composite silicon carbide base and plate material, applied in the field of silicon carbide ceramic preparation, can solve the problems of high production cost, application limitation, low utilization rate of raw materials, etc., achieves strong wettability and bonding ability, safe and environmentally friendly production process, The effect of high heat conduction and heat dissipation

Inactive Publication Date: 2016-03-02
HEFEI LONG DUO ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] As the power and density of electronic components increase, the calorific value per unit volume also increases, and the requirements for the comprehensive performance of circuit substrates are getting higher and higher. Among them, ceramic substrates have good comprehensive performance in terms of insulation, thermal conductivity and Thermal expansion, chemical stability and other aspects are outstanding, and are gradually widely used in substrate materials. Among them, alumina and beryllium oxide are mainly used as substrate materials for a long time. However, alumina ceramic sheets have low thermal conductivity and thermal expansion. The coefficient does not match with Si and other shortcomings. Although the comprehensive performance of beryllium oxide ceramics is relatively good, its production cost is high and toxic. Although the comprehensive performance of aluminum nitride ceramics is relatively good, the production cost is high and the application is also limited. Silicon carbide as a substrate material has obvious advantages in terms of performance
[0003] Although the application prospects of silicon carbide ceramic substrates are broad, in the actual production process, there are problems such as low sintering density, low utilization rate of raw materials, and insulation to be improved, which restrict the large-scale use of such materials. Further improvements in the production process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] The ceramic material in this embodiment is made of the following raw materials in parts by weight: silicon carbide 60, aluminum borate whiskers 4, nano-aluminum nitride 5, yttrium sol 5 with a solid content of 10%, silane coupling agent kh5501, glycerin 8, ethyl Glycol 5, polyethylene glycol 1, copper oxide 1, nano ceramic powder transparent liquid 10, deionized water 50.

[0012] Its preparation method is:

[0013] (1) Disperse the silicon carbide ball mill for 12 hours first, then add nano-aluminum nitride and silane coupling agent kh550 to continue mixing and ball milling for 3 hours, then add other remaining materials, mix and disperse for 4 hours in a closed ball mill, and dry the obtained slurry completely for 200 Mesh sieve;

[0014] (2) Put the above-mentioned sieved powder into a mold for pressing and molding, and the obtained green body is subjected to debinding treatment at 400°C. After the treatment, the green body is sent into a vacuum resistance furnace, ...

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PUM

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Abstract

The invention discloses a tough and high-elastic composite silicon-carbide-based ceramic circuit board base board material. According to a silicon-carbide-based ceramic base board, micron-grade silicon carbide powder and nano-scale aluminum nitride powder are used in a composited mode, so that the base material can have more efficient thermal conductivity, polyethylene glycol composite solvent containing yttrium sol and nanometer ceramic powder transparent liquid is great in wettability and bonding capability for powder, all materials can be evenly dispersed and cladded, the effects of effective melting enhancement and strength improvement are achieved, the composite ceramic base board high in compactness, elasticity and strength can be obtained at the lower sintering temperature, and the material is good in electric insulating property, high in heat conduction and dissipation efficiency, safe and environment-friendly in production process and great in utilization potentiality.

Description

technical field [0001] The invention relates to the technical field of preparing silicon carbide ceramics, in particular to a tough and high-elastic composite silicon carbide-based ceramic circuit board substrate material and a preparation method thereof. Background technique [0002] As the power and density of electronic components increase, the calorific value per unit volume also increases, and the requirements for the comprehensive performance of circuit substrates are getting higher and higher. Among them, ceramic substrates have good comprehensive performance in terms of insulation, thermal conductivity and Thermal expansion, chemical stability and other aspects are outstanding, and are gradually widely used in substrate materials. Among them, alumina and beryllium oxide are mainly used as substrate materials for a long time. However, alumina ceramic sheets have low thermal conductivity and thermal expansion. The coefficient does not match with Si and other shortcomin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/81C04B35/565C04B35/622
Inventor 王丹丹王乐平夏运明涂聚友
Owner HEFEI LONG DUO ELECTRONICS SCI & TECH
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